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SMTA International 2024
SMTA International 2024
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Sunday
, October 20
Room 41
1:30pm •
PDC4: Failure Analysis of Electronic Devices
Room 50
1:30pm •
PDC5: Fundamentals of Thermal Interface Materials
Room 51
1:30pm •
PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies
Room 52
1:30pm •
PDC2: LTS 101: Manufacturing Process Guidance for Implementation of SnBi Based Low Temperature Soldering for Consumer Products
Monday
, October 21
Room 40
8:30am •
PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Room 41
8:30am •
PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Room 44
8:30am •
PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Room 45
1:30pm •
WLP: Invited Keynote Presentations & Panel
4:00pm •
WLP: Round Table Discussion- Past Innovations, Present Challenges, and Future Trends in Electronics Manufacturing
5:00pm •
WLP: Connection Reception
Room 47/49
9:00am •
AME1: Additive Electronics Applications
10:30am •
AME2: Processes for Additive Manufacturing
12:00pm •
AME Keynote Presentation: Additively Manufactured Electronics - A View from The Ecosystem
1:30pm •
AME3: Interconnects and Non-Conformal Additive Circuits
3:30pm •
AME4: Additive Electronics Manufacturing
Room 51
8:30am •
PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Room 52
8:30am •
PDC7: Analytical Techniques in Electronics Manufacturing: Theory, Applications, and Data Interpretation
Tuesday
, October 22
Exhibit Halls D and C
4:00pm •
Electronics Exhibition
Room 44
8:30am •
INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection
10:30am •
INS2: Unique Materials and Lab-Based Inspection & Test Applications
1:00pm •
INS3: Evolution and Trends in Current Xray Inspection Applications & Technology
3:00pm •
INS4: Challenging AOI Applications
Room 45
8:30am •
PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Room 47/49
8:30am •
RHE1: Solder Joint Reliability
11:00am •
RHE2: Reliability Aspects of High Performance Components
1:00pm •
RHE3: Reliability and Cleanliness
3:00pm •
RHE4: Thermal Shock & Thermal Cycle Testing Comparisons
Room 48
8:30am •
MFX1: Reliability Challenges
10:30am •
MFX2: Large Panel Assembly
1:00pm •
MFX3: Design and Sustainability
3:00pm •
MFX4: Solder Pastes and Interconnection Materials
Room 50/51
3:30pm •
Electronics Manufacturing Assembly Collaborative: Workforce Development Efforts
Room 57
8:30am •
SMT Processes Certification Course
SMTA Booth #2853
5:00pm •
Passport Program Launch (Interactive Expo Networking Event)
Wednesday
, October 23
Exhibit Halls D and C
10:00am •
Electronics Exhibition
12:00pm •
Interactive Presentations on the Show Floor
Kings Rosemont
6:30pm •
Back to 1984: Celebrating 40 Years (SMTA Anniversary Party)
Murray Brothers Caddyshack
5:00pm •
SYP Happy Hour
Room 1 - Level 1
9:00am •
SMTAI Keynote Presentation: Crafting the Future- Leadership and Legacy in the Manufacturing Industry
Room 104
8:00am •
SMTA Annual Meeting
Room 44/46
11:30am •
LTS1: Thermal Fatigue Reliability
Room 45
11:00am •
APT1: Innovations in Wafer Level and Fan-Out Packaging
2:00pm •
APT2: Technological Advancements and System Solutions
Room 47/49
11:30am •
RHE5: Aspects of Reliability Modeling
2:00pm •
RHE6: Printed Circuit Board Considerations
Room 48
11:00am •
MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges
2:00pm •
MFX6: Cleaning Challenges and Solutions
SMTA Booth #2853
10:30am •
40 Under 40 Awards Ceremony
11:15am •
Knowledge Nugget Session on the Show Floor
3:30pm •
Ice Cream Social Hosted by The Great Lakes & Wisconsin Chapters
UHDI Pavillion Booth #2753
10:00am •
Ultra HDI Learning Pavilion Technical Program
Thursday
, October 24
Exhibit Halls D and C
9:00am •
Electronics Exhibition
Room 44/46
8:30am •
LTS2: Electromigration in Tin-Bismuth Solders
10:30am •
LTS3: Unique Low Temp Soldering Processes and Quality Control Methods
1:00pm •
LTS4: Innovative LTS Material and Process Developments to Overcome Assembly
Room 45
8:30am •
APT3: Package Modeling and Simulation
10:30am •
APT4: Advanced Materials and Process 1
1:00pm •
APT5: Advanced Materials and Process 2
Room 47/49
8:30am •
RHE7: Pb-free Solder Alloy Reliability
10:30am •
RHE8: Material Specifications for High Performance
Room 48
9:00am •
MFX7: SIR Practical Studies
10:30am •
MFX8: Solder Processes
1:00pm •
MFX9: Printing and Printing Processes
SMTA Booth #2853
10:15am •
Innovating Education Session: Exploring a New Video Course Format
12:30pm •
SMTA Workforce Development Collaborative
UHDI Pavillion Booth #2753
10:00am •
Ultra HDI Learning Pavilion Technical Program
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Oct 20
-
24, 2024
Sunday
, October 20
Monday
, October 21
Tuesday
, October 22
Wednesday
, October 23
Thursday
, October 24
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Donald E Stephens Convention Center, Rosemont, IL, USA
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Exhibit Halls D and C
Kings Rosemont
Murray Brothers Caddyshack
Room 1 - Level 1
Room 104
Room 40
Room 41
Room 44
Room 44/46
Room 45
Room 47/49
Room 48
Room 50
Room 50/51
Room 51
Room 52
Room 57
SMTA Booth #2853
UHDI Pavillion Booth #2753
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Sunday
, October 20
Monday
, October 21
Tuesday
, October 22
Wednesday
, October 23
Thursday
, October 24
Session Type
Certification
Conference Session
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AME Track
APT Track
INS Track
LTS Track
MFX Track
RHE Track
Exhibition
Free Show Floor Presentations
All
Education Session
Nugget
UHDI Pavillion
Professional Development Course
Special Event
Students & Young Professionals
Women's Leadership Program
Workforce Development
All
EMAC
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Popular