SMTA International 2024

Chair: Burt Carpenter, NXP Semiconductors
Co-Chair:

8:30am-9:00am
>>The Next Generation of Si-Interposers
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

9:00am-9:30am
>>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University

9:30am-10:00am
>>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies
Josh Akman, Ansys
Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.