SMTA International 2024

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SMTA International 2024

1:30pm CDT

PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies Room 51 PDC4: Failure Analysis of Electronic Devices Room 41 PDC5: Fundamentals of Thermal Interface Materials Room 50

8:30am CDT

PDC10: Assembly: Best Practices for Improving Manufacturing Productivity Room 40 PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product Room 41 PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders Room 51 PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities Room 44

9:00am CDT

AME1: Additive Electronics Applications Room 47/49

10:30am CDT

AME2: Processes for Additive Manufacturing Room 47/49

12:00pm CDT

AME Keynote Presentation: Additively Manufactured Electronics - A View from The Ecosystem Room 47/49

1:30pm CDT

AME3: Interconnects and Non-Conformal Additive Circuits Room 47/49 WLP: Invited Keynote Presentations & Panel Room 45

3:30pm CDT

AME4: Additive Electronics Manufacturing Room 47/49

4:00pm CDT

WLP: Round Table Discussion- Past Innovations, Present Challenges, and Future Trends in Electronics Manufacturing Room 45

5:00pm CDT

WLP: Connection Reception Room 45

8:30am CDT

INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection Room 44 MFX1: Reliability Challenges Room 48 RHE1: Solder Joint Reliability Room 47/49 PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods Room 45 SMT Processes Certification Course Room 57

10:30am CDT

INS2: Unique Materials and Lab-Based Inspection & Test Applications Room 44 MFX2: Large Panel Assembly Room 48

11:00am CDT

RHE2: Reliability Aspects of High Performance Components Room 47/49

1:00pm CDT

INS3: Evolution and Trends in Current Xray Inspection Applications & Technology Room 44 MFX3: Design and Sustainability Room 48 RHE3: Reliability and Cleanliness Room 47/49

3:00pm CDT

INS4: Challenging AOI Applications Room 44 MFX4: Solder Pastes and Interconnection Materials Room 48 RHE4: Thermal Shock & Thermal Cycle Testing Comparisons Room 47/49

3:30pm CDT

Electronics Manufacturing Assembly Collaborative: Workforce Development Efforts Room 50/51

4:00pm CDT

Electronics Exhibition Exhibit Halls D and C

5:00pm CDT

Passport Program Launch (Interactive Expo Networking Event) SMTA Booth #2853

5:15pm CDT

RHE: Town Hall Thermal Cycling Thermal Shock Room 47/49

8:00am CDT

SMTA Annual Meeting Room 104

9:00am CDT

SMTAI Keynote Presentation: Crafting the Future- Leadership and Legacy in the Manufacturing Industry Room 1 - Level 1

10:00am CDT

Electronics Exhibition Exhibit Halls D and C Ultra HDI Learning Pavilion Technical Program UHDI Pavillion Booth #2753

10:30am CDT

40 Under 40 Awards Ceremony SMTA Booth #2853

11:00am CDT

APT1: Innovations in Wafer Level and Fan-Out Packaging Room 45 MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges Room 48

11:15am CDT

Knowledge Nugget Session on the Show Floor SMTA Booth #2853

11:30am CDT

LTS1: Thermal Fatigue Reliability Room 44/46 RHE5: Aspects of Reliability Modeling Room 47/49

12:00pm CDT

Interactive Presentations on the Show Floor Exhibit Halls D and C

2:00pm CDT

APT2: Technological Advancements and System Solutions Room 45 MFX6: Cleaning Challenges and Solutions Room 48 RHE6: Printed Circuit Board Considerations Room 47/49

3:30pm CDT

Ice Cream Social Hosted by The Great Lakes & Wisconsin Chapters SMTA Booth #2853

5:00pm CDT

SYP Happy Hour Murray Brothers Caddyshack

6:30pm CDT

Back to 1984: Celebrating 40 Years (SMTA Anniversary Party) Kings Rosemont

8:30am CDT

APT3: Package Modeling and Simulation Room 45 LTS2: Electromigration in Tin-Bismuth Solders Room 44/46 MFX7: Solder Processes Room 48

9:00am CDT

RHE7: Pb-free Solder Alloy Reliability Room 47/49 Electronics Exhibition Exhibit Halls D and C

10:00am CDT

Ultra HDI Learning Pavilion Technical Program UHDI Pavillion Booth #2753

10:15am CDT

Innovating Education Session: Exploring a New Video Course Format SMTA Booth #2853

10:30am CDT

RHE8: Material Specifications for High Performance Room 47/49 APT4: Advanced Materials and Process 1 Room 45 LTS3: Unique Low Temp Soldering Processes and Quality Control Methods Room 44/46 MFX8: Printing and Printing Processes Room 48

12:30pm CDT

SMTA Workforce Development Collaborative SMTA Booth #2853

1:00pm CDT

APT5: Advanced Materials and Process 2 Room 45 LTS4: Innovative LTS Material and Process Developments to Overcome Assembly Room 44/46