8:30am-9:00am >>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies Kunal Shah, Ph.D., Lilotree
9:00am-9:30am >>DRAM Damage Due to X-Ray Inspections Post PCB Assembly Surabh Gupta, Ph.D., Intel Corporation
9:30am-10:00am >>Case Studies of Harsh Application Environments, the Unforeseen Situations *Christopher Genthe, *Kelly Flanagan, Rockwell Automation
Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48