SMTA International 2024

Chair: Vasu Vasudevan, Dell
Co-Chair:

8:30am-9:00am
>>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints
*Prabjit Singh, Ph.D., IBM Corporation
Co-Authors: See paper for full listing

9:00am-9:30am
>>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints
*Kevin Byrd, Intel Corporation
Co-Authors: Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation

9:30am-10:00am
>>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
Alyssa Yaeger, Ph.D., Universal Instruments
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University