SMTA International 2024

Chair:
Co-Chair: Albert Wu, National Central University Taiwan

2:00pm-2:30pm
>>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
Agustin Vasquez, Ph.D., Intel Corporation
Co-Authors: Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Corporation

2:30pm-3:00pm
>>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
Saddam Daradkeh, Ph.D., Auburn University
Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University

3:00pm-3:30pm
>>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling
Miles Moreau, KIC
Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology