SMTA International 2024

Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology
Co-Chair:

1:00pm-1:30pm
>>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS
*Francis Mutuku, Indium Corporation
Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation

1:30pm-2:00pm
>>Wave Soldering the Lower Temperature Solder- A Case Study
*Keith Sweatman, Nihon Superior Co., Ltd
Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland

2:00pm-2:30pm
>>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits
*Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation