PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC
Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.
Monday October 21, 2024 8:30am - 12:00pm CDT
Room 41
