SMTA International 2024

Chair: Maurice Dore, Valeo
Co-Chair:

10:30am-11:00am
>>Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
*Evan Griffith, Indium Corporation
Co-Authors: David Heller, Xike Zhao, Phil Lehrer, Heller Industries

11:00am-11:30am
>>Reduction of Condensate Residues in the Reflow Process by Targeted Control of Chemical Reactions
*Viktoria Rawinski, Rawinski GmbH

11:30am-12:00pm
>>How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance
*Westin Bent, MacDermid Alpha Electronics Solutions
Co-Authors: Jennifer Fijalkowski, Geoffrey Post, MacDermid Alpha Electronics Solutions; Shinichi Kitamiya, Ken Takahashi, Japan Unix