SMTA International 2024

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin