Name: LTS3: Unique Low Temp Soldering Processes and Quality Control Methods
Start: 2024-10-24T10:30:00-0500
End: 2024-10-24T12:00:00-0500

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 44/46

Chair: Prabjit Singh, Ph.D., IBM Corporation
Co-Chair:

10:30am-11:00am
>>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions
*Kevin Byrd, Intel Corporation
Co-Authors: Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation

11:00am-11:30am
>>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components
Watson Tseng, Shenmao Technology Inc.

11:30am-12:00pm
>>Unique Quality Control for The Success in Product Level Certification of Low Temperature Soldering with SnBi Based Alloy
Kok Kwan Tang, TechLeap

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 44/46

Conference Session, LTS Track

SMTA International 2024

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