SMTA International 2024

Chair: Charles Woychik, Nhanced Semiconductors
Co-Chair:

10:30am-11:00am
>>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV)
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

11:00am-11:30am
>>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste
Albert Wu, National Central University
Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.

11:30am-12:00pm
>>Non-toxic Stabilization for Mixed Reaction Gold
Sandra Nelle, Atotech Deutschland GmbH & Co. KG
Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG