Chair: Pradeep Lall, Ph.D., Auburn University Co-Chair: Marie Cole, Formerly with IBM Corporation
9:00am-9:30am >>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP) Mike Vinson, Electroninks Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks
9:30am-10:00am >>3D Aerosol Jet Printed Interconnects on Bare Die *Tom Rovere, Lockheed Martin Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin
Monday October 21, 2024 9:00am - 10:00am CDT
Room 47/49
