SMTA International 2024

Chair: Maurice Dore, Valeo
Co-Chair:

8:30am-9:00am
>>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish
Alakayleh Abdallah, Auburn University
Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University

9:00am-9:30am
>>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy
*Anna Lifton, MacDermid Alpha Electronics
Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University

9:30am-10:00am
>>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys
Menghong Wang, Ph.D., Auburn University
Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University