Name: MFX4: Solder Pastes and Interconnection Materials
Start: 2024-10-22T15:00:00-0500
End: 2024-10-22T16:00:00-0500

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 48

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48

Conference Session, MFX Track

SMTA International 2024

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