SMTA International 2024

Chair: Francis Mutuku, Indium Corporation
Co-Chair:

11:30am-12:00am
>>Thermal Cycle Fatigue Life of Low Temperature Solders
*Michael Osterman, CALCE/University of Maryland
Co-Author: Aaron Mendelsohn, CALCE/University of Maryland

12:00pm-12:30pm
>>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project