SMTA International 2024

Chair: Laura Cohen, Woodward
Co-Chair:

11:30am-12:00pm
>>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

12:00pm-12:30pm
>>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals