SMTA International 2024

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SMTA International 2024

9:00am CDT

AME1: Additive Electronics Applications Room 47/49

10:30am CDT

AME2: Processes for Additive Manufacturing Room 47/49

12:00pm CDT

AME Keynote Presentation: Additively Manufactured Electronics - A View from The Ecosystem Room 47/49

1:30pm CDT

AME3: Interconnects and Non-Conformal Additive Circuits Room 47/49

3:30pm CDT

AME4: Additive Electronics Manufacturing Room 47/49

8:30am CDT

INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection Room 44 MFX1: Reliability Challenges Room 48 RHE1: Solder Joint Reliability Room 47/49

10:30am CDT

INS2: Unique Materials and Lab-Based Inspection & Test Applications Room 44 MFX2: Large Panel Assembly Room 48

11:00am CDT

RHE2: Reliability Aspects of High Performance Components Room 47/49

1:00pm CDT

INS3: Evolution and Trends in Current Xray Inspection Applications & Technology Room 44 MFX3: Design and Sustainability Room 48 RHE3: Reliability and Cleanliness Room 47/49

3:00pm CDT

INS4: Challenging AOI Applications Room 44 MFX4: Solder Pastes and Interconnection Materials Room 48 RHE4: Thermal Shock & Thermal Cycle Testing Comparisons Room 47/49

11:00am CDT

APT1: Innovations in Wafer Level and Fan-Out Packaging Room 45 MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges Room 48

11:30am CDT

LTS1: Thermal Fatigue Reliability Room 44/46 RHE5: Aspects of Reliability Modeling Room 47/49

2:00pm CDT

APT2: Technological Advancements and System Solutions Room 45 MFX6: Cleaning Challenges and Solutions Room 48 RHE6: Printed Circuit Board Considerations Room 47/49

8:30am CDT

APT3: Package Modeling and Simulation Room 45 LTS2: Electromigration in Tin-Bismuth Solders Room 44/46 RHE7: Pb-free Solder Alloy Reliability Room 47/49

9:00am CDT

MFX7: SIR Practical Studies Room 48

10:30am CDT

RHE8: Material Specifications for High Performance Room 47/49 APT4: Advanced Materials and Process 1 Room 45 LTS3: Unique Low Temp Soldering Processes and Quality Control Methods Room 44/46 MFX8: Solder Processes Room 48

1:00pm CDT

MFX9: Printing and Printing Processes Room 48 APT5: Advanced Materials and Process 2 Room 45 LTS4: Innovative LTS Material and Process Developments to Overcome Assembly Room 44/46