SMTA International 2024: Full Schedule

8:30am CDT

MFX1: Reliability Challenges

Tuesday October 22, 2024 8:30am - 10:00am CDT

Chair: Maria Tanasescu, AMD
Co-Chair:

8:30am-9:00am
>>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies
Kunal Shah, Ph.D., Lilotree

9:00am-9:30am
>>DRAM Damage Due to X-Ray Inspections Post PCB Assembly
Surabh Gupta, Ph.D., Intel Corporation

9:30am-10:00am
>>Case Studies of Harsh Application Environments, the Unforeseen Situations
*Christopher Genthe, *Kelly Flanagan, Rockwell Automation

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48

Conference Session, MFX Track

10:30am CDT

MFX2: Large Panel Assembly

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 48

Chair:
Co-Chair:

10:30am-11:00am
>>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond
*Paul Wang, Ph.D., MiTAC Computer Technology
Co-Author: Dennis Willie, Flex

11:00am-11:30am
>>Large Form Factor Surface Mount Technology Process Demonstration
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation

11:30am-12:00pm
>>Examination of Cutting Edge Quality and the Influences of Laser Depaneling
Jake Benz, LPKF Laser & Electronics North America
Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

MFX3: Design and Sustainability

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 48

Chair: Jon Ashton, CSMTPE, Universal Instruments
Co-Chair: Mei-Ming Khaw, Keysight Technologies

1:00pm-1:30pm
>>Sustainable and Strategic Design to Combat Component Unavailability
*Kathryn Ackerman, Sourceability

1:30pm-2:00pm
>>Design for Manufacturability - Perspectives from a Manufacturing Engineer
David Spitz, Ansys, Inc.

2:00pm-2:30pm
>>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process
Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University
Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 48

Conference Session, MFX Track

3:00pm CDT

MFX4: Solder Pastes and Interconnection Materials

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 48

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48

Conference Session, MFX Track

11:00am CDT

MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Room 48

Chair:
Co-Chair:

11:00am-11:30am
>>Electronic Assembly Rework Best Practices When Building to a No-Clean and Cleaning Conditions
*Mike Bixenman, MBA, DBA, Magnalytix, LLC
Co-Authors: J.D. Buller, AIR-VAC

11:30am-12:00pm
>>An Investigation in Rinse Water Sustainability
*Ram Wissel, KYZEN Corporation
Co-Author: Rod Chilton, ITW EAE

12:00pm-12:30pm
>>A Case Study on Assembly Process Optimization of 0201 BTC Diodes for High Temperature Reflow
Prathik Rudresh, Vicor Power
Co-Author: Chrys Shea, Shea Engineering Services

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 48

Conference Session, MFX Track

2:00pm CDT

MFX6: Cleaning Challenges and Solutions

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 48

Chair:
Co-Chair:

2:00pm-2:30pm
>>Cleaning Under Bottom Terminated Components - Importance of Good Rinsing
*Vladimir Sitko, PBT Works s.r.o.
Co-Author: Mike Bixenmann, MBA, DBA, Magnalytix, LLC

2:30pm-3:00pm
>>Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
*Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; *Patrick Lawrence, ITW EAE; *Evan Griffith, Indium Corporation

3:00pm-3:30pm
>>Using Technical Cleanliness Assessments to Reduce Manufacturing Defect
Shelia Hamilton, Teknek

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 48

Conference Session, MFX Track

9:00am CDT

MFX7: SIR Practical Studies

Thursday October 24, 2024 9:00am - 10:00am CDT

Room 48

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

9:00am-9:30am
>>Aerosol Jet Printing, A Promising Emerging Technology for Printed Electronics (Potential SIR Patterns)
Jaime Regis, Ph.D., Honeywell FM&T

9:30am-10:00am
>>Aerosol Printing SIR Patterns on Real World Components. The Potential for Value-Added Real-World Data
Jaime Regis, Ph.D., Honeywell FM&T

Thursday October 24, 2024 9:00am - 10:00am CDT
Room 48

Conference Session, MFX Track

10:30am CDT

MFX8: Solder Processes

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 48

Chair: Maurice Dore, Valeo
Co-Chair:

10:30am-11:00am
>>Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
*Evan Griffith, Indium Corporation
Co-Authors: David Heller, Xike Zhao, Phil Lehrer, Heller Industries

11:00am-11:30am
>>Reduction of Condensate Residues in the Reflow Process by Targeted Control of Chemical Reactions
*Viktoria Rawinski, Rawinski GmbH

11:30am-12:00pm
>>How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance
*Westin Bent, MacDermid Alpha Electronics Solutions
Co-Authors: Jennifer Fijalkowski, Geoffrey Post, MacDermid Alpha Electronics Solutions; Shinichi Kitamiya, Ken Takahashi, Japan Unix

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

MFX9: Printing and Printing Processes

Thursday October 24, 2024 1:00pm - 2:00pm CDT

Room 48

Chair:
Co-Chair:

1:00pm-1:30pm
>>Meeting the Challenges of Ultra-fine Feature Printing and Reflow Through Optimization of Pb-free Solder Paste
*Tony Lentz, FCT Solder

1:30pm-2:00pm
>>Investigation of Overprinting BGA Pads: It Should Print Better Than This!
Jeff Schake, ASMPT

Thursday October 24, 2024 1:00pm - 2:00pm CDT
Room 48

Conference Session, MFX Track