SMTA International 2024

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, Formerly with IBM Corporation

9:00am-9:30am
>>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP)
Mike Vinson, Electroninks
Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks

9:30am-10:00am
>>3D Aerosol Jet Printed Interconnects on Bare Die
*Tom Rovere, Lockheed Martin
Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin

Chair: Andy Behr, Panasonic
Co-Chair:

10:30am-11:00am
>>Sensors and Process-Performance Interactions for Additive In-Mold Electronics in Automotive Applications
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Hyesoo Jang, Ved Soni, Fatahi Musa, Md Golam Sarwar, Scott Miller, Auburn University

11:00am-11:30am
>>Current Minimum Micro Bump Size Using Gravure Offset Equipment
Douglas Schardt, Komori America Corp
Co-Authors: Shunichi Haraguchi, Chisato Oyama, Kotarou Usuda, Yoshihiro Ohyama, Ikeda Hideki, Komori Corporation

11:30am-12:00pm
>>Additive Manufactured Electronics for Next Generation Microelectronics
Kenneth Church, nScrypt, Inc.

Additively Manufactured Electronics: A View from The Ecosystem
Speaker: Arthur Wall, Ph.D., Director of Engineering and Fab Operations, NextFlex

Additive technology is changing our world. Simple 3D printed structures have evolved to become critical components in the manufacture of devices that we could not have imagined just a few years ago. Now comes the emergence of, the implementation of, and the continued evolution of, additive electronics. There are so many exciting examples of materials, tools, processes, and systems that are now emerging in the ecosystem indicating that this new technology cannot be ignored. More importantly, it is being adopted into manufacturing today. In this discussion, we will explore several well-known manufacturing approaches that push the boundaries of today’s capability and new entrants with innovative methods and materials. We will also describe the importance of additive electronics manufacturing for its impact ono environmental sustainability. Finally, future developments of systems and applications will be presented as part of an overall electronics national strategy.

Meet Art Wall
Art Wall is Director of Engineering and Fab Operations at NextFlex, managing the Technology Hub which houses multiple process tools for Additive and Flexible Hybrid Electronics development and prototyping. Prior to joining NextFlex, Art led many different groups and technologies associated with hard drive products for both IBM and Hitachi Global Storage Technologies. His most recent efforts prior to joining NextFlex were as a co-founder and Vice President of NuvoSun, an innovative photovoltaic company that was acquired by The Dow Chemical Company. Art has a Ph.D. in Materials Science from the University of Minnesota. Art has co-authored more than 30 articles in refereed journals, presented at more than 30 US and International Conferences, and holds 7 US patents.

Chair: MP Divakar, Stack Design Automation
Co-Chair:

1:30pm-2:00pm
>>SMT Processing using Printed Anisotropic Conductive Epoxy for Direct Die Attach of Wire-bondable Chips on Flexible Additively Manufactured Electronics
Madhu Stemmerman, Sunray Scientific

2:00pm-2:30pm
>>Interconnecting and Soldering to Printed Ink Metallization Using Photonic Processes
Harry Chou, Ph.D., PulseForge
Co-Authors: Ogadimma John Okwuoma, Dave Pope, Ph.D., Ian Rawson, Ara Parsekian, Ph.D., PulseForge

2:30pm-3:00pm
>>In-Mold Electronics: An Additive Manufacturing Approach for Integrated, Robust and 3D Electronics
Rahul Raut, MacDermid Alpha Electronics Solutions
Co-Authors: Bawa Singh, NirmalyaKumar Chaki, Chetan Shah, Vasuki Kaushik, Supriya Devarajan, MacDermid Alpha Electronics Solutions

Chair: MP Divakar, Stack Design Automation
Co-Chair:

3:30pm-4:00pm
>>Breaking Barriers: Advancing Electronics Tooling and Pallet Manufacturing with Additive Manufacturing
Jeff DeGrange, Impossible Objects
Co-Author: Dan Migely, Impossible Objects

4:00pm-4:30pm
>>Supercooled Solder Pastes in Low Temperature Attach Applications
Yifan Wu, Ph.D., Indium Corporation
Co-Authors: Ian Tevis, Radhika Jadhav, Indium Corporation

4:30pm-5:00pm
>>AI-Powered Real-Time Inspection for Electronic Component Assembly
Sean Bouskila, Cybord
Co-Author: Eyal Weiss, Cybord

Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.

8:30am-9:00am
>>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

9:00am-9:30am
>>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature
Mathias Nowottnick, University of Rostock
Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock

9:30am-10:00am
>> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies
*Anna Lifton, Macdermid Alpha Electronics Solutions
Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions

Chair:
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination
Victoria Delissio, Heraeus Electronics

11:30am-12:00pm
>>Board Level Reliability Testing of RF Packages
Mumtaz Bora, Psemi

Chair:
Co-Chair: Doug Pauls, Collins Aerospace

1:00pm-1:30pm
>>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments
*Mike Konrad, Aqueous Technologies

1:30pm-2:00pm
>>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board
Donghyun Kim, Ph.D., Nokia Bell Labs
Co-Author: Chen Xu, Nokia Bell Labs

2:00pm-2:30pm
>>A New Approach to Process Qualification – SIR Testing + Functional Components
*Mike Bixenman, MBA, DBA, Magnalytix LLC
Co-Authors: Terry Munson, Foresite

Chair: David Hillman, Hillman Electronic Assembly Solutions
Co-Chair: Chloe Feng, Nokia Bell Labs

3:30pm-4:00pm
>>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints
*Jayse McLean, John Deere Intelligent Solutions Group

4:00pm-4:30pm
>>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points
*Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering

4:30pm-5:00pm
>>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

Chair: Laura Cohen, Woodward
Co-Chair:

11:30am-12:00pm
>>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

12:00pm-12:30pm
>>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals

Chair:
Co-Chair: Albert Wu, National Central University Taiwan

2:00pm-2:30pm
>>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
Lavanya Ashok Swaminathan, Intel Corporation
Co-Authors: Agustin Vasquez, Ph.D., Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Corporation

2:30pm-3:00pm
>>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
Saddam Daradkeh, Ph.D., Auburn University
Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University

3:00pm-3:30pm
>>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling
Miles Moreau, KIC
Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology

Chair: Maurice Dore, Valeo
Co-Chair:

8:30am-9:00am
>>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish
Alakayleh Abdallah, Auburn University
Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University

9:00am-9:30am
>>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy
*Anna Lifton, MacDermid Alpha Electronics
Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University

9:30am-10:00am
>>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys
Menghong Wang, Ph.D., Auburn University
Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University

Chair: Laura Cohen, Woodward
Co-Chair:

10:30am-11:00am
>>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems
*Michael Osterman, CALCE

11:00am-11:30am
>>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
Rita Mohanty, Ph.D., Henkel Electronics
Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation