SMTA International 2024

FREE FOR ALL ATTENDEES!
Chairs: Marie Cole, Formerly with IBM Corporation; Priyanka Dobriyal, Intel Corporation

>>AI Era - Work, Life, Technology, Leadership, and Women"
Jennie Hwang, Ph.D., H-Technologies Group

>>Coming soon!
Mandy Long, BigBear AI

>>Women Shaping SMTA: Past Contributions and Future Visions
The panel aims to highlight the contributions of remarkable women who have made significant impacts to the industry, championed diversity, and played pivotal roles in advancing SMTA while on the Board of Directors.
​​​Panelists (Time Served on SMTA Board of Directors)
Moderator: Michelle Ogihara, Seika Machinery (2011-2016)
Debbie Carboni, KYZEN Corporation (2014-2020)
Marie Cole, IBM Corporation (2008-2013)
Priyanka Dobriyal, Ph.D. , Intel Corporation (2023-Current)
Eileen Hibbler, SMTA (2016-2018)
Tanya Martin, SMTA (Global Excutive Director)
Julie Silk, Keysight Technologies (2019-Current)
Frances Stewart, PCEA (1996-1998)

FREE FOR ALL ATTENDEES
Join experts and fellow attendees to explore the evolution and innovation of the different electronics manufacturing sectors. Topics include:

>>Past, Present, and Future of Soldering
Hosted by: Gayle Towell, AIM Solder

>>Past, Present, and Future of Cleaning/High Reliability

>>Past, Present, and Future of Marketing/Sales
Hosted by: Stephanie Austin, Zentech Manufacturing

>>Past, Present and Future of Research & Development

>>Past, Present and Future of Green Energy/Sustainability

FREE FOR ALL ATTENDEES

Join the Women's Leadership Program as we mingle with drinks and nibbles with fellow attendees!
More details coming soon….

PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Instructor: Michael Vinson, Electroninks

This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication.
Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Innovative Intelligent System Architectures for Heterogeneous Integration Assembly
Gregg Taran, Universal Instruments
Co-Author: Glenn Farris, Universal Instruments

2:30pm-3:00pm
>>Making Cost-effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

3:00pm-3:30pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Chair: Burt Carpenter, NXP Semiconductors
Co-Chair:

8:30am-9:00am
>>The Next Generation of Si-Interposers
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

9:00am-9:30am
>>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University

9:30am-10:00am
>>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies
Josh Akman, Ansys
Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.

Chair: Charles Woychik, Nhanced Semiconductors
Co-Chair:

10:30am-11:00am
>>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV)
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

11:00am-11:30am
>>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste
Albert Wu, National Central University
Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.

11:30am-12:00pm
>>Non-toxic Stabilization for Mixed Reaction Gold
Sandra Nelle, Atotech Deutschland GmbH & Co. KG
Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG

Chair: Dale Lee, Plexus Corp.
Co-Chair:

1:00pm-1:30pm
>>Beyond the Technical Data Sheet
Deborah Hagen, Ph.D., Sandia National Labs
Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs

1:30pm-2:00pm
>>2nd Generation of TIM
Mina Yaghmazadeh, Ph.D., SJ Electronics
Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics

2:00pm-2:30pm
>>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material
Rita Mohanty, Ph.D., Henkel Corporation
Co-Author: Blake Wageman, Henkel Corporation