SMTA International 2024

Chair: Francis Mutuku, Indium Corporation
Co-Chair:

11:30am-12:00am
>>Thermal Cycle Fatigue Life of Low Temperature Solders
*Michael Osterman, CALCE/University of Maryland
Co-Author: Aaron Mendelsohn, CALCE/University of Maryland

12:00pm-12:30pm
>>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project

Chair: Vasu Vasudevan, Dell
Co-Chair:

8:30am-9:00am
>>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints
*Prabjit Singh, Ph.D., IBM Corporation
Co-Authors: See paper for full listing

9:00am-9:30am
>>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints
*Kevin Byrd, Intel Corporation
Co-Authors: Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation

9:30am-10:00am
>>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
Alyssa Yaeger, Ph.D., Universal Instruments
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University

Chair: Prabjit Singh, Ph.D., IBM Corporation
Co-Chair:

10:30am-11:00am
>>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions
*Kevin Byrd, Intel Corporation
Co-Authors: Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation

11:00am-11:30am
>>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components
Watson Tseng, Shenmao Technology Inc.

11:30am-12:00pm
>>Unique Quality Control for The Success in Product Level Certification of Low Temperature Soldering with SnBi Based Alloy
Kok Kwan Tang, TechLeap

Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology
Co-Chair:

1:00pm-1:30pm
>>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS
*Francis Mutuku, Indium Corporation
Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation

1:30pm-2:00pm
>>Wave Soldering the Lower Temperature Solder- A Case Study
*Keith Sweatman, Nihon Superior Co., Ltd
Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland

2:00pm-2:30pm
>>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits
*Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation