SMTA International 2024

PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Instructor: Jennie Hwang, Ph.D., H-Technologies Group

As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course also highlights what it takes to achieve AI with justified confidence.

Integrated with a variety of use cases, tips, and recommendations, the key components behind the AI technologies including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, and ChatGPT-led AI boom will be outlined, and “possible” AI future will be highlighted. All industry sectors are expected to reorient around AI; the ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!

Chair:
Co-Chair:

8:30am-9:00am
>>Machine Vision-Based Plated Through Hole Defect Inspection Model for Large-Scale PCB Manufacturing Industries
Jinal Prajapati, Watson Institute for System Excellence, Binghamton University
Co-Authors: Soujanya Nagaraja Rao Malur, Prashanth Tamilselvam, Darshil Patel, Daryl Santos, Watson Institute for System Excellence, Binghamton University

9:00am-9:30am
>>Artificial Intelligence and its Role in Improving Automated Optical Inspection
Edward Pechin, Vitrox USA


9:30am-10:00am
>>Machine Learning-Based Server Testing and Debugging Model for Large-Scale PCB Manufacturing Industries
Soujanya Nagaraja Rao Malur, Binghamton University
Co-Authors: Aditya Shobhawat, Foxconn Industrial Internet; Darshil Rajeshkumar Patel, Daryl Santos, Ph.D., Watson Institute for Systems Excellence, Binghamton University

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

10:30am-11:00am
>>Using True 3D to Optimize Your Dispensing Process: A Journey Toward Zero Defects
Daniel Perry, Koh Young Technology, Inc.

11:00am-11:30am
>>Calibration of Tweezer Meters Enabling Sub-1pF and Sub-1nH Measurements
Michael Obrecht, Ph.D., Siborg Systems Inc

11:30am-12:00pm
>>A Survey of the Sources of Ionic Contamination as Measured by Ion Chromatography during Electronics Manufacturing
*Adam Klett, Ph.D., KYZEN Corporation
Co-Authors: Ram Wissel, James Perigen, KYZEN Corporation

Chair: Maria Tanasescu, AMD
Co-Chair:

1:00pm-1:30pm
>>Review of the Latest Developments of the Xray Inspection Technology for PCBAs and Microelectronics Designs
Evstatin Krastev, Ph.D., Nordson

1:30pm-2:00pm
>>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection
Nick Fieldhouse, M.S., Omron Inspection Systems

2:00pm-2:30pm
>>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control
Eric McElmurry, Viscom USA

Chair: Maria Tanasescu, AMD
Co-Chair:

3:30pm-4:00pm
>>Pre- and Post-Solder AOI for THT
John Johnson, EAP

4:00pm-4:30pm
>>Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys 
Gayle Towell, AIM Solder
Co-Authors: Timothy O’Neill, Carlos Tafoya, Andres Lozoya, AIM Solder; Nick Fieldhouse, Omron Inspection Systems