SMTA International 2024

PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies
Instructor: Amy Lujan,SavanSys Solutions LLC

This PDC will present process flows and analyze the cost drivers of mature and advanced packaging technologies. Activity-based cost modeling will be used, and this course will explain why and how cost modeling is useful. The technologies covered are wire bond, flip chip, wafer-level packaging (fan-in and fan-out), and interposer-based packaging (also called 2.5D). Each packaging technology will be introduced, process flow(s) will be presented in step-by- step detail, and cost drivers will be highlighted. Cost drivers are design parameters that have a notable impact on the final package cost. All types of direct cost will be covered, including labor, material, capital, tooling, and yield; indirect costs will be explained as well. Case studies will be provided for each packaging technology. The goal of this PDC is to teach which design details drive different types of cost to both technical and non-technical people in the microelectronics supply chain. With a better understanding of packaging technology cost drivers, cost-effective decisions can be made.

PDC2: LTS 101: Manufacturing Process Guidance for Implementation of SnBi Based Low Temperature Soldering for Consumer Products
Instructor: Kok Kwan Tang, TechLeap PLT

Interest in Low Temperature Soldering (LTS) as a soldering technology solution for consumer products has been on the rise. The primary challenge limiting the adoption of LTS is the lack of knowledge to define and optimize the manufacturing process, identify solutions to overcome manufacturing defects, define and execute LTS product certification. This course is constructed with learnings from actual LTS product implementation in High Volume Manufacturing, collectively >20 consumer products since 2016. This course will also walk through key factors to successfully implement and certify consumer products with the LTS process.

PDC4: Failure Analysis of Electronic Devices
Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis

The supply chain of electronic devices is large and complex. It comprises designers, component suppliers, board manufacturers and assembly providers. When something goes wrong, the failure mechanism is not always obvious. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear. In this workshop, we will review the tools of failure analysis, explaining each technique and what information it provides. Concrete examples will be used.

PDC5: Fundamentals of Thermal Interface Materials
Instructor: Rita Mohanty, Ph.D., Henkel Corporation

The cooling of electronics is critical to the safety, performance, and reliability of contemporary electronic systems. Electronics industries continue to move towards highly integrated devices with smaller feature sizes and higher currents with smaller footprint devices. Higher functionality comes with the price of high heat generation due to higher power dissipation. In general, heat from a system can be removed by conduction, convection and radiation. For most electronic applications, heat is primarily removed by transferring heat by conduction and natural convection through a solid medium. Polymer base Thermal Interface Material (TIM) is one of the most effecting media used in thermal management today.
TIM offer many benefits beyond exceptional thermal management such as electrical isolation for high power electronics, vibration dampening leading to improved reliability, tolerance stack up issue for mechanical parts leading to cost savings in product design, low outgassing to meet NASA outgassing criteria, just to name a few. Thermal interface material comes in different forms such as film, liquid and paste to fill gap from micron scale to millimeter scale. In this course, we will discuss some common types of TIM used in TIM 2 and TIM 1.5 applications. Value associated with each type of TIM and their common applications will be discussed here.

PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Instructor: Phil Zarrow, Jim Hall, ITM Consulting

You have the responsibility and resources to improve the productivity of an assembly operation....what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line
engineers involved in manufacturing, design and quality engineering.

PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC

Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found  in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.

PDC7: Analytical Techniques in Electronics Manufacturing: Theory, Applications, and Data Interpretation"
Instructor: Adam Klett, Ph.D., KYZEN Corporation

Whether you're an executive, a seasoned researcher, or a newcomer, this course is designed to sharpen
your analytical prowess and equip you with the knowledge and skills necessary for advancing electronics
manufacturing. This course offers an in-depth exploration of analytical techniques ubiquitous in electronics
manufacturing, including:
• Fourier Transform Infrared Spectroscopy (FTIR)
• Ion Chromatography (IC)
• Scanning Electron Microscopy with Energy-Dispersive X-ray Spectroscopy (SEM/EDS)
• Resistivity of Solvent Extract (ROSE)

Participants will gain a comprehensive understanding of the theoretical foundations, practical applications, and nuanced interpretation of raw data associated with each method. The journey begins with thoroughly examining the underlying principles governing these techniques, providing a solid theoretical framework. Subsequently, the course delves into the capabilities and limitations of each method, shedding light on their unique strengths and potential pitfalls. Central to the course is the exploration of strategies for interpreting raw data. Through real-world case studies and interactive discussions, participants will learn to extract meaningful insights from complex datasets, enhancing their analytical skills and decision-making capabilities.

PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Instructors: Chrys Shea, Shea Engineering Services and Raymond Lawrence, CeTaQ

This advanced course is designed for process engineers and technical leaders who want to learn how to improve the productivity of their SMT lines. Emphasis is on the relationships among different process variables, how to characterize them, and how to maximize yields and throughputs. The course begins with an overview of quality attributes and how to apply workmanship standards to achieve acceptable conditions while minimizing rework. It then details each SMT process on a typical assembly line, including automated inspection, and discusses how each can factor into process indicators or unacceptable outputs. After reviewing the processing factors that influence defects, process control methods are introduced. Discussions then focus on designed experiments to identify the main drivers of quality output, and line balancing for optimizing throughput. The technical discussions turn to business discussions - of financial considerations, the cost of defects, capital equipment justifications and data-driven evaluation methods for assembly machines and materials. Equipment evaluation, characterization, and process control are emphasized in the final portion of the course, encouraging attendees to integrate the concepts of quality, repeatability, and profitability as they apply to SMT manufacturing.

PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Instructor: Jennie Hwang, Ph.D., H-Technologies Group

As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course also highlights what it takes to achieve AI with justified confidence.

Integrated with a variety of use cases, tips, and recommendations, the key components behind the AI technologies including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, and ChatGPT-led AI boom will be outlined, and “possible” AI future will be highlighted. All industry sectors are expected to reorient around AI; the ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!

PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Instructor: Michael Vinson, Electroninks

This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication.
Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.