Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.
8:30am-9:00am >>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys *Richard Coyle, Ph.D., Nokia Bell Labs Co-Authors: See paper for full listing
9:00am-9:30am >>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature Mathias Nowottnick, University of Rostock Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock
9:30am-10:00am >> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies *Anna Lifton, Macdermid Alpha Electronics Solutions Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions
Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 47/49
Chair: Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology
11:00am-11:30am >>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination Victoria Delissio, Heraeus Electronics
1:00pm-1:30pm >>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments *Mike Konrad, Aqueous Technologies
1:30pm-2:00pm >>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board Donghyun Kim, Ph.D., Nokia Bell Labs Co-Author: Chen Xu, Nokia Bell Labs
2:00pm-2:30pm >>A New Approach to Process Qualification – SIR Testing + Functional Components *Mike Bixenman, MBA, DBA, Magnalytix LLC Co-Authors: Terry Munson, Foresite
Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 47/49
Chair: David Hillman, Hillman Electronic Assembly Solutions Co-Chair: Chloe Feng, Nokia Bell Labs
3:30pm-4:00pm >>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints *Jayse McLean, John Deere Intelligent Solutions Group
4:00pm-4:30pm >>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points *Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering
4:30pm-5:00pm >>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability *Richard Coyle, Ph.D., Nokia Bell Labs Co-Authors: See paper for full listing
Tuesday October 22, 2024 3:00pm - 4:30pm CDT
Room 47/49
11:30am-12:00pm >>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints Jean-Baptiste Libot, Ph.D., Hooke Electronics Co-Author: Philippe Milesi, Hooke Electronics
12:00pm-12:30pm >>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings Melanie Mathon, Inventec Performance Chemicals Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals
Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 47/49
Chair: Co-Chair: Albert Wu, National Central University Taiwan
2:00pm-2:30pm >>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs Lavanya Ashok Swaminathan, Intel Corporation Co-Authors: Agustin Vasquez, Ph.D., Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Corporation
2:30pm-3:00pm >>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys Saddam Daradkeh, Ph.D., Auburn University Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University
3:00pm-3:30pm >>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling Miles Moreau, KIC Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology
Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 47/49
8:30am-9:00am >>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish Alakayleh Abdallah, Auburn University Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University
9:00am-9:30am >>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy *Anna Lifton, MacDermid Alpha Electronics Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University
9:30am-10:00am >>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys Menghong Wang, Ph.D., Auburn University Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 47/49
10:30am-11:00am >>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems *Michael Osterman, CALCE
11:00am-11:30am >>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use Rita Mohanty, Ph.D., Henkel Electronics Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation
Thursday October 24, 2024 10:30am - 11:30am CDT
Room 47/49
