SMTA International 2024

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Innovative Intelligent System Architectures for Heterogeneous Integration Assembly
Gregg Taran, Universal Instruments
Co-Author: Glenn Farris, Universal Instruments

2:30pm-3:00pm
>>Making Cost-effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

3:00pm-3:30pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Chair: Burt Carpenter, NXP Semiconductors
Co-Chair:

8:30am-9:00am
>>The Next Generation of Si-Interposers
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

9:00am-9:30am
>>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University

9:30am-10:00am
>>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies
Josh Akman, Ansys
Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.

Chair: Charles Woychik, Nhanced Semiconductors
Co-Chair:

10:30am-11:00am
>>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV)
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

11:00am-11:30am
>>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste
Albert Wu, National Central University
Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.

11:30am-12:00pm
>>Non-toxic Stabilization for Mixed Reaction Gold
Sandra Nelle, Atotech Deutschland GmbH & Co. KG
Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG

Chair: Dale Lee, Plexus Corp.
Co-Chair:

1:00pm-1:30pm
>>Beyond the Technical Data Sheet
Deborah Hagen, Ph.D., Sandia National Labs
Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs

1:30pm-2:00pm
>>2nd Generation of TIM
Mina Yaghmazadeh, Ph.D., SJ Electronics
Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics

2:00pm-2:30pm
>>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material
Rita Mohanty, Ph.D., Henkel Corporation
Co-Author: Blake Wageman, Henkel Corporation