SMTA International 2024

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, Formerly with IBM Corporation

9:00am-9:30am
>>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP)
Mike Vinson, Electroninks
Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks

9:30am-10:00am
>>3D Aerosol Jet Printed Interconnects on Bare Die
*Tom Rovere, Lockheed Martin
Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin

Chair: Andy Behr, Panasonic
Co-Chair:

10:30am-11:00am
>>Sensors and Process-Performance Interactions for Additive In-Mold Electronics in Automotive Applications
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Hyesoo Jang, Ved Soni, Fatahi Musa, Md Golam Sarwar, Scott Miller, Auburn University

11:00am-11:30am
>>Current Minimum Micro Bump Size Using Gravure Offset Equipment
Douglas Schardt, Komori America Corp
Co-Authors: Shunichi Haraguchi, Chisato Oyama, Kotarou Usuda, Yoshihiro Ohyama, Ikeda Hideki, Komori Corporation

11:30am-12:00pm
>>Additive Manufactured Electronics for Next Generation Microelectronics
Kenneth Church, nScrypt, Inc.

Additively Manufactured Electronics: A View from The Ecosystem
Speaker: Arthur Wall, Ph.D., Director of Engineering and Fab Operations, NextFlex

Additive technology is changing our world. Simple 3D printed structures have evolved to become critical components in the manufacture of devices that we could not have imagined just a few years ago. Now comes the emergence of, the implementation of, and the continued evolution of, additive electronics. There are so many exciting examples of materials, tools, processes, and systems that are now emerging in the ecosystem indicating that this new technology cannot be ignored. More importantly, it is being adopted into manufacturing today. In this discussion, we will explore several well-known manufacturing approaches that push the boundaries of today’s capability and new entrants with innovative methods and materials. We will also describe the importance of additive electronics manufacturing for its impact ono environmental sustainability. Finally, future developments of systems and applications will be presented as part of an overall electronics national strategy.

Meet Art Wall
Art Wall is Director of Engineering and Fab Operations at NextFlex, managing the Technology Hub which houses multiple process tools for Additive and Flexible Hybrid Electronics development and prototyping. Prior to joining NextFlex, Art led many different groups and technologies associated with hard drive products for both IBM and Hitachi Global Storage Technologies. His most recent efforts prior to joining NextFlex were as a co-founder and Vice President of NuvoSun, an innovative photovoltaic company that was acquired by The Dow Chemical Company. Art has a Ph.D. in Materials Science from the University of Minnesota. Art has co-authored more than 30 articles in refereed journals, presented at more than 30 US and International Conferences, and holds 7 US patents.

Chair: MP Divakar, Stack Design Automation
Co-Chair:

1:30pm-2:00pm
>>SMT Processing using Printed Anisotropic Conductive Epoxy for Direct Die Attach of Wire-bondable Chips on Flexible Additively Manufactured Electronics
Madhu Stemmerman, Sunray Scientific

2:00pm-2:30pm
>>Interconnecting and Soldering to Printed Ink Metallization Using Photonic Processes
Harry Chou, Ph.D., PulseForge
Co-Authors: Ogadimma John Okwuoma, Dave Pope, Ph.D., Ian Rawson, Ara Parsekian, Ph.D., PulseForge

2:30pm-3:00pm
>>In-Mold Electronics: An Additive Manufacturing Approach for Integrated, Robust and 3D Electronics
Rahul Raut, MacDermid Alpha Electronics Solutions
Co-Authors: Bawa Singh, NirmalyaKumar Chaki, Chetan Shah, Vasuki Kaushik, Supriya Devarajan, MacDermid Alpha Electronics Solutions

Chair: MP Divakar, Stack Design Automation
Co-Chair:

3:30pm-4:00pm
>>Breaking Barriers: Advancing Electronics Tooling and Pallet Manufacturing with Additive Manufacturing
Jeff DeGrange, Impossible Objects
Co-Author: Dan Migely, Impossible Objects

4:00pm-4:30pm
>>Supercooled Solder Pastes in Low Temperature Attach Applications
Yifan Wu, Ph.D., Indium Corporation
Co-Authors: Ian Tevis, Radhika Jadhav, Indium Corporation

4:30pm-5:00pm
>>AI-Powered Real-Time Inspection for Electronic Component Assembly
Sean Bouskila, Cybord
Co-Author: Eyal Weiss, Cybord