SMTA International 2024: Full Schedule

9:00am CDT

AME1: Additive Electronics Applications

Monday October 21, 2024 9:00am - 10:00am CDT

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, Formerly with IBM Corporation

9:00am-9:30am
>>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP)
Mike Vinson, Electroninks
Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks

9:30am-10:00am
>>3D Aerosol Jet Printed Interconnects on Bare Die
*Tom Rovere, Lockheed Martin
Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin

Monday October 21, 2024 9:00am - 10:00am CDT
Room 47/49

Conference Session, AME Track

10:30am CDT

AME2: Processes for Additive Manufacturing

Monday October 21, 2024 10:30am - 12:00pm CDT

Room 47/49

Chair: Andy Behr, Panasonic
Co-Chair:

10:30am-11:00am
>>Sensors and Process-Performance Interactions for Additive In-Mold Electronics in Automotive Applications
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Hyesoo Jang, Ved Soni, Fatahi Musa, Md Golam Sarwar, Scott Miller, Auburn University

11:00am-11:30am
>>Current Minimum Micro Bump Size Using Gravure Offset Equipment
Douglas Schardt, Komori America Corp
Co-Authors: Shunichi Haraguchi, Chisato Oyama, Kotarou Usuda, Yoshihiro Ohyama, Ikeda Hideki, Komori Corporation

11:30am-12:00pm
>>Additive Manufactured Electronics for Next Generation Microelectronics
Kenneth Church, nScrypt, Inc.

Monday October 21, 2024 10:30am - 12:00pm CDT
Room 47/49

Conference Session, AME Track

12:00pm CDT

AME Keynote Presentation: Additively Manufactured Electronics - A View from The Ecosystem

Monday October 21, 2024 12:00pm - 1:00pm CDT

Room 47/49

Additively Manufactured Electronics: A View from The Ecosystem
Speaker: Arthur Wall, Ph.D., Director of Engineering and Fab Operations, NextFlex

Additive technology is changing our world. Simple 3D printed structures have evolved to become critical components in the manufacture of devices that we could not have imagined just a few years ago. Now comes the emergence of, the implementation of, and the continued evolution of, additive electronics. There are so many exciting examples of materials, tools, processes, and systems that are now emerging in the ecosystem indicating that this new technology cannot be ignored. More importantly, it is being adopted into manufacturing today. In this discussion, we will explore several well-known manufacturing approaches that push the boundaries of today’s capability and new entrants with innovative methods and materials. We will also describe the importance of additive electronics manufacturing for its impact ono environmental sustainability. Finally, future developments of systems and applications will be presented as part of an overall electronics national strategy.

Meet Art Wall
Art Wall is Director of Engineering and Fab Operations at NextFlex, managing the Technology Hub which houses multiple process tools for Additive and Flexible Hybrid Electronics development and prototyping. Prior to joining NextFlex, Art led many different groups and technologies associated with hard drive products for both IBM and Hitachi Global Storage Technologies. His most recent efforts prior to joining NextFlex were as a co-founder and Vice President of NuvoSun, an innovative photovoltaic company that was acquired by The Dow Chemical Company. Art has a Ph.D. in Materials Science from the University of Minnesota. Art has co-authored more than 30 articles in refereed journals, presented at more than 30 US and International Conferences, and holds 7 US patents.

Monday October 21, 2024 12:00pm - 1:00pm CDT
Room 47/49

Conference Session, AME Track

1:30pm CDT

AME3: Interconnects and Non-Conformal Additive Circuits

Monday October 21, 2024 1:30pm - 3:00pm CDT

Room 47/49

Chair: MP Divakar, Stack Design Automation
Co-Chair:

1:30pm-2:00pm
>>SMT Processing using Printed Anisotropic Conductive Epoxy for Direct Die Attach of Wire-bondable Chips on Flexible Additively Manufactured Electronics
Madhu Stemmerman, Sunray Scientific

2:00pm-2:30pm
>>Interconnecting and Soldering to Printed Ink Metallization Using Photonic Processes
Harry Chou, Ph.D., PulseForge
Co-Authors: Ogadimma John Okwuoma, Dave Pope, Ph.D., Ian Rawson, Ara Parsekian, Ph.D., PulseForge

2:30pm-3:00pm
>>In-Mold Electronics: An Additive Manufacturing Approach for Integrated, Robust and 3D Electronics
Rahul Raut, MacDermid Alpha Electronics Solutions
Co-Authors: Bawa Singh, NirmalyaKumar Chaki, Chetan Shah, Vasuki Kaushik, Supriya Devarajan, MacDermid Alpha Electronics Solutions

Monday October 21, 2024 1:30pm - 3:00pm CDT
Room 47/49

Conference Session, AME Track

3:30pm CDT

AME4: Additive Electronics Manufacturing

Monday October 21, 2024 3:30pm - 5:00pm CDT

Room 47/49

Chair: MP Divakar, Stack Design Automation
Co-Chair:

3:30pm-4:00pm
>>Breaking Barriers: Advancing Electronics Tooling and Pallet Manufacturing with Additive Manufacturing
Jeff DeGrange, Impossible Objects
Co-Author: Dan Migely, Impossible Objects

4:00pm-4:30pm
>>Supercooled Solder Pastes in Low Temperature Attach Applications
Yifan Wu, Ph.D., Indium Corporation
Co-Authors: Ian Tevis, Radhika Jadhav, Indium Corporation

4:30pm-5:00pm
>>AI-Powered Real-Time Inspection for Electronic Component Assembly
Sean Bouskila, Cybord
Co-Author: Eyal Weiss, Cybord

Monday October 21, 2024 3:30pm - 5:00pm CDT
Room 47/49

Conference Session, AME Track

8:30am CDT

INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 44

Chair:
Co-Chair:

8:30am-9:00am
>>Machine Vision-Based Plated Through Hole Defect Inspection Model for Large-Scale PCB Manufacturing Industries
Jinal Prajapati, Watson Institute for System Excellence, Binghamton University
Co-Authors: Soujanya Nagaraja Rao Malur, Prashanth Tamilselvam, Darshil Patel, Daryl Santos, Watson Institute for System Excellence, Binghamton University

9:00am-9:30am
>>Artificial Intelligence and its Role in Improving Automated Optical Inspection
Edward Pechin, Vitrox USA

9:30am-10:00am
>>Machine Learning-Based Server Testing and Debugging Model for Large-Scale PCB Manufacturing Industries
Soujanya Nagaraja Rao Malur, Binghamton University
Co-Authors: Aditya Shobhawat, Foxconn Industrial Internet; Darshil Rajeshkumar Patel, Daryl Santos, Ph.D., Watson Institute for Systems Excellence, Binghamton University

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 44

Conference Session, INS Track

8:30am CDT

MFX1: Reliability Challenges

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 48

Chair: Maria Tanasescu, AMD
Co-Chair:

8:30am-9:00am
>>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies
Kunal Shah, Ph.D., Lilotree

9:00am-9:30am
>>DRAM Damage Due to X-Ray Inspections Post PCB Assembly
Surabh Gupta, Ph.D., Intel Corporation

9:30am-10:00am
>>Case Studies of Harsh Application Environments, the Unforeseen Situations
*Christopher Genthe, *Kelly Flanagan, Rockwell Automation

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48

Conference Session, MFX Track

8:30am CDT

RHE1: Solder Joint Reliability

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 47/49

Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.

8:30am-9:00am
>>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

9:00am-9:30am
>>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature
Mathias Nowottnick, University of Rostock
Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock

9:30am-10:00am
>> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies
*Anna Lifton, Macdermid Alpha Electronics Solutions
Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 47/49

Conference Session, RHE Track

10:30am CDT

INS2: Unique Materials and Lab-Based Inspection & Test Applications

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 44

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

10:30am-11:00am
>>Using True 3D to Optimize Your Dispensing Process: A Journey Toward Zero Defects
Daniel Perry, Koh Young Technology, Inc.

11:00am-11:30am
>>Calibration of Tweezer Meters Enabling Sub-1pF and Sub-1nH Measurements
Michael Obrecht, Ph.D., Siborg Systems Inc

11:30am-12:00pm
>>A Survey of the Sources of Ionic Contamination as Measured by Ion Chromatography during Electronics Manufacturing
*Adam Klett, Ph.D., KYZEN Corporation
Co-Authors: Ram Wissel, James Perigen, KYZEN Corporation

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 44

Conference Session, INS Track

10:30am CDT

MFX2: Large Panel Assembly

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 48

Chair:
Co-Chair:

10:30am-11:00am
>>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond
*Paul Wang, Ph.D., MiTAC Computer Technology
Co-Author: Dennis Willie, Flex

11:00am-11:30am
>>Large Form Factor Surface Mount Technology Process Demonstration
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation

11:30am-12:00pm
>>Examination of Cutting Edge Quality and the Influences of Laser Depaneling
Jake Benz, LPKF Laser & Electronics North America
Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

11:00am CDT

RHE2: Reliability Aspects of High Performance Components

Tuesday October 22, 2024 11:00am - 12:00pm CDT

Room 47/49

Chair:
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination
Victoria Delissio, Heraeus Electronics

11:30am-12:00pm
>>Board Level Reliability Testing of RF Packages
Mumtaz Bora, Psemi

Tuesday October 22, 2024 11:00am - 12:00pm CDT
Room 47/49

Conference Session, RHE Track

1:00pm CDT

INS3: Evolution and Trends in Current Xray Inspection Applications & Technology

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

1:00pm-1:30pm
>>Review of the Latest Developments of the Xray Inspection Technology for PCBAs and Microelectronics Designs
Evstatin Krastev, Ph.D., Nordson

1:30pm-2:00pm
>>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection
Nick Fieldhouse, M.S., Omron Inspection Systems

2:00pm-2:30pm
>>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control
Eric McElmurry, Viscom USA

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 44

Conference Session, INS Track

1:00pm CDT

MFX3: Design and Sustainability

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 48

Chair: Jon Ashton, CSMTPE, Universal Instruments
Co-Chair: Mei-Ming Khaw, Keysight Technologies

1:00pm-1:30pm
>>Sustainable and Strategic Design to Combat Component Unavailability
*Kathryn Ackerman, Sourceability

1:30pm-2:00pm
>>Design for Manufacturability - Perspectives from a Manufacturing Engineer
David Spitz, Ansys, Inc.

2:00pm-2:30pm
>>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process
Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University
Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

RHE3: Reliability and Cleanliness

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 47/49

Chair:
Co-Chair: Doug Pauls, Collins Aerospace

1:00pm-1:30pm
>>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments
*Mike Konrad, Aqueous Technologies

1:30pm-2:00pm
>>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board
Donghyun Kim, Ph.D., Nokia Bell Labs
Co-Author: Chen Xu, Nokia Bell Labs

2:00pm-2:30pm
>>A New Approach to Process Qualification – SIR Testing + Functional Components
*Mike Bixenman, MBA, DBA, Magnalytix LLC
Co-Authors: Terry Munson, Foresite

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 47/49

Conference Session, RHE Track

3:00pm CDT

INS4: Challenging AOI Applications

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

3:30pm-4:00pm
>>Pre- and Post-Solder AOI for THT
John Johnson, EAP

4:00pm-4:30pm
>>Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys
Gayle Towell, AIM Solder
Co-Authors: Timothy O’Neill, Carlos Tafoya, Andres Lozoya, AIM Solder; Nick Fieldhouse, Omron Inspection Systems

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 44

Conference Session, INS Track

3:00pm CDT

MFX4: Solder Pastes and Interconnection Materials

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 48

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48

Conference Session, MFX Track

3:00pm CDT

RHE4: Thermal Shock & Thermal Cycle Testing Comparisons

Tuesday October 22, 2024 3:00pm - 4:30pm CDT

Room 47/49

Chair: David Hillman, Hillman Electronic Assembly Solutions
Co-Chair: Chloe Feng, Nokia Bell Labs

3:30pm-4:00pm
>>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints
*Jayse McLean, John Deere Intelligent Solutions Group

4:00pm-4:30pm
>>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points
*Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering

4:30pm-5:00pm
>>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

Tuesday October 22, 2024 3:00pm - 4:30pm CDT
Room 47/49

Conference Session, RHE Track

11:00am CDT

APT1: Innovations in Wafer Level and Fan-Out Packaging

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Room 45

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 45

Conference Session, APT Track

11:00am CDT

MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Room 48

Chair:
Co-Chair:

11:00am-11:30am
>>Electronic Assembly Rework Best Practices When Building to a No-Clean and Cleaning Conditions
*Mike Bixenman, MBA, DBA, Magnalytix, LLC
Co-Authors: J.D. Buller, AIR-VAC

11:30am-12:00pm
>>An Investigation in Rinse Water Sustainability
*Ram Wissel, KYZEN Corporation
Co-Author: Rod Chilton, ITW EAE

12:00pm-12:30pm
>>A Case Study on Assembly Process Optimization of 0201 BTC Diodes for High Temperature Reflow
Prathik Rudresh, Vicor Power
Co-Author: Chrys Shea, Shea Engineering Services

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 48

Conference Session, MFX Track

11:30am CDT

LTS1: Thermal Fatigue Reliability

Wednesday October 23, 2024 11:30am - 12:30pm CDT

Room 44/46

Chair: Francis Mutuku, Indium Corporation
Co-Chair:

11:30am-12:00am
>>Thermal Cycle Fatigue Life of Low Temperature Solders
*Michael Osterman, CALCE/University of Maryland
Co-Author: Aaron Mendelsohn, CALCE/University of Maryland

12:00pm-12:30pm
>>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project

Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 44/46

Conference Session, LTS Track

11:30am CDT

RHE5: Aspects of Reliability Modeling

Wednesday October 23, 2024 11:30am - 12:30pm CDT

Room 47/49

Chair: Laura Cohen, Woodward
Co-Chair:

11:30am-12:00pm
>>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

12:00pm-12:30pm
>>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals

Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 47/49

Conference Session, RHE Track

2:00pm CDT

APT2: Technological Advancements and System Solutions

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 45

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Innovative Intelligent System Architectures for Heterogeneous Integration Assembly
Gregg Taran, Universal Instruments
Co-Author: Glenn Farris, Universal Instruments

2:30pm-3:00pm
>>Making Cost-effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

3:00pm-3:30pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 45

Conference Session, APT Track

2:00pm CDT

MFX6: Cleaning Challenges and Solutions

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 48

Chair:
Co-Chair:

2:00pm-2:30pm
>>Cleaning Under Bottom Terminated Components - Importance of Good Rinsing
*Vladimir Sitko, PBT Works s.r.o.
Co-Author: Mike Bixenmann, MBA, DBA, Magnalytix, LLC

2:30pm-3:00pm
>>Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
*Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; *Patrick Lawrence, ITW EAE; *Evan Griffith, Indium Corporation

3:00pm-3:30pm
>>Using Technical Cleanliness Assessments to Reduce Manufacturing Defect
Shelia Hamilton, Teknek

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 48

Conference Session, MFX Track

2:00pm CDT

RHE6: Printed Circuit Board Considerations

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 47/49

Chair:
Co-Chair: Albert Wu, National Central University Taiwan

2:00pm-2:30pm
>>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
Lavanya Ashok Swaminathan, Intel Corporation
Co-Authors: Agustin Vasquez, Ph.D., Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Corporation

2:30pm-3:00pm
>>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
Saddam Daradkeh, Ph.D., Auburn University
Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University

3:00pm-3:30pm
>>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling
Miles Moreau, KIC
Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 47/49

Conference Session, RHE Track

8:30am CDT

APT3: Package Modeling and Simulation

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 45

Chair: Burt Carpenter, NXP Semiconductors
Co-Chair:

8:30am-9:00am
>>The Next Generation of Si-Interposers
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

9:00am-9:30am
>>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University

9:30am-10:00am
>>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies
Josh Akman, Ansys
Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 45

Conference Session, APT Track

8:30am CDT

LTS2: Electromigration in Tin-Bismuth Solders

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 44/46

Chair: Vasu Vasudevan, Dell
Co-Chair:

8:30am-9:00am
>>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints
*Prabjit Singh, Ph.D., IBM Corporation
Co-Authors: See paper for full listing

9:00am-9:30am
>>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints
*Kevin Byrd, Intel Corporation
Co-Authors: Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation

9:30am-10:00am
>>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
Alyssa Yaeger, Ph.D., Universal Instruments
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 44/46

Conference Session, LTS Track

8:30am CDT

RHE7: Pb-free Solder Alloy Reliability

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 47/49

Chair: Maurice Dore, Valeo
Co-Chair:

8:30am-9:00am
>>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish
Alakayleh Abdallah, Auburn University
Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University

9:00am-9:30am
>>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy
*Anna Lifton, MacDermid Alpha Electronics
Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University

9:30am-10:00am
>>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys
Menghong Wang, Ph.D., Auburn University
Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 47/49

Conference Session, RHE Track

9:00am CDT

MFX7: SIR Practical Studies

Thursday October 24, 2024 9:00am - 10:00am CDT

Room 48

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

9:00am-9:30am
>>Aerosol Jet Printing, A Promising Emerging Technology for Printed Electronics (Potential SIR Patterns)
Jaime Regis, Ph.D., Honeywell FM&T

9:30am-10:00am
>>Aerosol Printing SIR Patterns on Real World Components. The Potential for Value-Added Real-World Data
Jaime Regis, Ph.D., Honeywell FM&T

Thursday October 24, 2024 9:00am - 10:00am CDT
Room 48

Conference Session, MFX Track

10:30am CDT

RHE8: Material Specifications for High Performance

Thursday October 24, 2024 10:30am - 11:30am CDT

Room 47/49

Chair: Laura Cohen, Woodward
Co-Chair:

10:30am-11:00am
>>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems
*Michael Osterman, CALCE

11:00am-11:30am
>>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
Rita Mohanty, Ph.D., Henkel Electronics
Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation

Thursday October 24, 2024 10:30am - 11:30am CDT
Room 47/49

Conference Session, RHE Track

10:30am CDT

APT4: Advanced Materials and Process 1

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 45

Chair: Charles Woychik, Nhanced Semiconductors
Co-Chair:

10:30am-11:00am
>>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV)
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

11:00am-11:30am
>>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste
Albert Wu, National Central University
Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.

11:30am-12:00pm
>>Non-toxic Stabilization for Mixed Reaction Gold
Sandra Nelle, Atotech Deutschland GmbH & Co. KG
Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 45

Conference Session, APT Track

10:30am CDT

LTS3: Unique Low Temp Soldering Processes and Quality Control Methods

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 44/46

Chair: Prabjit Singh, Ph.D., IBM Corporation
Co-Chair:

10:30am-11:00am
>>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions
*Kevin Byrd, Intel Corporation
Co-Authors: Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation

11:00am-11:30am
>>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components
Watson Tseng, Shenmao Technology Inc.

11:30am-12:00pm
>>Unique Quality Control for The Success in Product Level Certification of Low Temperature Soldering with SnBi Based Alloy
Kok Kwan Tang, TechLeap

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 44/46

Conference Session, LTS Track

10:30am CDT

MFX8: Solder Processes

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 48

Chair: Maurice Dore, Valeo
Co-Chair:

10:30am-11:00am
>>Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
*Evan Griffith, Indium Corporation
Co-Authors: David Heller, Xike Zhao, Phil Lehrer, Heller Industries

11:00am-11:30am
>>Reduction of Condensate Residues in the Reflow Process by Targeted Control of Chemical Reactions
*Viktoria Rawinski, Rawinski GmbH

11:30am-12:00pm
>>How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance
*Westin Bent, MacDermid Alpha Electronics Solutions
Co-Authors: Jennifer Fijalkowski, Geoffrey Post, MacDermid Alpha Electronics Solutions; Shinichi Kitamiya, Ken Takahashi, Japan Unix

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

MFX9: Printing and Printing Processes

Thursday October 24, 2024 1:00pm - 2:00pm CDT

Room 48

Chair:
Co-Chair:

1:00pm-1:30pm
>>Meeting the Challenges of Ultra-fine Feature Printing and Reflow Through Optimization of Pb-free Solder Paste
*Tony Lentz, FCT Solder

1:30pm-2:00pm
>>Investigation of Overprinting BGA Pads: It Should Print Better Than This!
Jeff Schake, ASMPT

Thursday October 24, 2024 1:00pm - 2:00pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

APT5: Advanced Materials and Process 2

Thursday October 24, 2024 1:00pm - 2:30pm CDT

Room 45

Chair: Dale Lee, Plexus Corp.
Co-Chair:

1:00pm-1:30pm
>>Beyond the Technical Data Sheet
Deborah Hagen, Ph.D., Sandia National Labs
Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs

1:30pm-2:00pm
>>2nd Generation of TIM
Mina Yaghmazadeh, Ph.D., SJ Electronics
Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics

2:00pm-2:30pm
>>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material
Rita Mohanty, Ph.D., Henkel Corporation
Co-Author: Blake Wageman, Henkel Corporation

Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 45

Conference Session, APT Track

1:00pm CDT

LTS4: Innovative LTS Material and Process Developments to Overcome Assembly

Thursday October 24, 2024 1:00pm - 2:30pm CDT

Room 44/46

Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology
Co-Chair:

1:00pm-1:30pm
>>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS
*Francis Mutuku, Indium Corporation
Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation

1:30pm-2:00pm
>>Wave Soldering the Lower Temperature Solder- A Case Study
*Keith Sweatman, Nihon Superior Co., Ltd
Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland

2:00pm-2:30pm
>>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits
*Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation

Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 44/46

Conference Session, LTS Track