SMTA International 2024: Full Schedule

1:30pm CDT

PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies

Sunday October 20, 2024 1:30pm - 5:00pm CDT

PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies
Instructor: Amy Lujan,SavanSys Solutions LLC

This PDC will present process flows and analyze the cost drivers of mature and advanced packaging technologies. Activity-based cost modeling will be used, and this course will explain why and how cost modeling is useful. The technologies covered are wire bond, flip chip, wafer-level packaging (fan-in and fan-out), and interposer-based packaging (also called 2.5D). Each packaging technology will be introduced, process flow(s) will be presented in step-by- step detail, and cost drivers will be highlighted. Cost drivers are design parameters that have a notable impact on the final package cost. All types of direct cost will be covered, including labor, material, capital, tooling, and yield; indirect costs will be explained as well. Case studies will be provided for each packaging technology. The goal of this PDC is to teach which design details drive different types of cost to both technical and non-technical people in the microelectronics supply chain. With a better understanding of packaging technology cost drivers, cost-effective decisions can be made.

Sunday October 20, 2024 1:30pm - 5:00pm CDT
Room 51

Professional Development Course

1:30pm CDT

PDC2: LTS 101: Manufacturing Process Guidance for Implementation of SnBi Based Low Temperature Soldering for Consumer Products

Sunday October 20, 2024 1:30pm - 5:00pm CDT

Room 52

PDC2: LTS 101: Manufacturing Process Guidance for Implementation of SnBi Based Low Temperature Soldering for Consumer Products
Instructor: Kok Kwan Tang, TechLeap PLT

Interest in Low Temperature Soldering (LTS) as a soldering technology solution for consumer products has been on the rise. The primary challenge limiting the adoption of LTS is the lack of knowledge to define and optimize the manufacturing process, identify solutions to overcome manufacturing defects, define and execute LTS product certification. This course is constructed with learnings from actual LTS product implementation in High Volume Manufacturing, collectively >20 consumer products since 2016. This course will also walk through key factors to successfully implement and certify consumer products with the LTS process.

Sunday October 20, 2024 1:30pm - 5:00pm CDT
Room 52

Professional Development Course

1:30pm CDT

PDC4: Failure Analysis of Electronic Devices

Sunday October 20, 2024 1:30pm - 5:00pm CDT

Room 41

PDC4: Failure Analysis of Electronic Devices
Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis

The supply chain of electronic devices is large and complex. It comprises designers, component suppliers, board manufacturers and assembly providers. When something goes wrong, the failure mechanism is not always obvious. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear. In this workshop, we will review the tools of failure analysis, explaining each technique and what information it provides. Concrete examples will be used.

Sunday October 20, 2024 1:30pm - 5:00pm CDT
Room 41

Professional Development Course

1:30pm CDT

PDC5: Fundamentals of Thermal Interface Materials

Sunday October 20, 2024 1:30pm - 5:00pm CDT

Room 50

PDC5: Fundamentals of Thermal Interface Materials
Instructor: Rita Mohanty, Ph.D., Henkel Corporation

The cooling of electronics is critical to the safety, performance, and reliability of contemporary electronic systems. Electronics industries continue to move towards highly integrated devices with smaller feature sizes and higher currents with smaller footprint devices. Higher functionality comes with the price of high heat generation due to higher power dissipation. In general, heat from a system can be removed by conduction, convection and radiation. For most electronic applications, heat is primarily removed by transferring heat by conduction and natural convection through a solid medium. Polymer base Thermal Interface Material (TIM) is one of the most effecting media used in thermal management today.
TIM offer many benefits beyond exceptional thermal management such as electrical isolation for high power electronics, vibration dampening leading to improved reliability, tolerance stack up issue for mechanical parts leading to cost savings in product design, low outgassing to meet NASA outgassing criteria, just to name a few. Thermal interface material comes in different forms such as film, liquid and paste to fill gap from micron scale to millimeter scale. In this course, we will discuss some common types of TIM used in TIM 2 and TIM 1.5 applications. Value associated with each type of TIM and their common applications will be discussed here.

Sunday October 20, 2024 1:30pm - 5:00pm CDT
Room 50

Professional Development Course

8:30am CDT

PDC10: Assembly: Best Practices for Improving Manufacturing Productivity

Monday October 21, 2024 8:30am - 12:00pm CDT

Room 40

PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Instructor: Phil Zarrow, Jim Hall, ITM Consulting

You have the responsibility and resources to improve the productivity of an assembly operation....what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line
engineers involved in manufacturing, design and quality engineering.

Monday October 21, 2024 8:30am - 12:00pm CDT
Room 40

Professional Development Course

8:30am CDT

PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product

Monday October 21, 2024 8:30am - 12:00pm CDT

Room 41

PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC

Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.

Monday October 21, 2024 8:30am - 12:00pm CDT
Room 41

Professional Development Course

8:30am CDT

PDC7: Analytical Techniques in Electronics Manufacturing: Theory, Applications, and Data Interpretation

Monday October 21, 2024 8:30am - 12:00pm CDT

Room 52

PDC7: Analytical Techniques in Electronics Manufacturing: Theory, Applications, and Data Interpretation"
Instructor: Adam Klett, Ph.D., KYZEN Corporation

Whether you're an executive, a seasoned researcher, or a newcomer, this course is designed to sharpen
your analytical prowess and equip you with the knowledge and skills necessary for advancing electronics
manufacturing. This course offers an in-depth exploration of analytical techniques ubiquitous in electronics
manufacturing, including:
• Fourier Transform Infrared Spectroscopy (FTIR)
• Ion Chromatography (IC)
• Scanning Electron Microscopy with Energy-Dispersive X-ray Spectroscopy (SEM/EDS)
• Resistivity of Solvent Extract (ROSE)

Participants will gain a comprehensive understanding of the theoretical foundations, practical applications, and nuanced interpretation of raw data associated with each method. The journey begins with thoroughly examining the underlying principles governing these techniques, providing a solid theoretical framework. Subsequently, the course delves into the capabilities and limitations of each method, shedding light on their unique strengths and potential pitfalls. Central to the course is the exploration of strategies for interpreting raw data. Through real-world case studies and interactive discussions, participants will learn to extract meaningful insights from complex datasets, enhancing their analytical skills and decision-making capabilities.

Monday October 21, 2024 8:30am - 12:00pm CDT
Room 52

Professional Development Course

8:30am CDT

PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders

Monday October 21, 2024 8:30am - 12:00pm CDT

Room 51

PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Instructors: Chrys Shea, Shea Engineering Services and Raymond Lawrence, CeTaQ

This advanced course is designed for process engineers and technical leaders who want to learn how to improve the productivity of their SMT lines. Emphasis is on the relationships among different process variables, how to characterize them, and how to maximize yields and throughputs. The course begins with an overview of quality attributes and how to apply workmanship standards to achieve acceptable conditions while minimizing rework. It then details each SMT process on a typical assembly line, including automated inspection, and discusses how each can factor into process indicators or unacceptable outputs. After reviewing the processing factors that influence defects, process control methods are introduced. Discussions then focus on designed experiments to identify the main drivers of quality output, and line balancing for optimizing throughput. The technical discussions turn to business discussions - of financial considerations, the cost of defects, capital equipment justifications and data-driven evaluation methods for assembly machines and materials. Equipment evaluation, characterization, and process control are emphasized in the final portion of the course, encouraging attendees to integrate the concepts of quality, repeatability, and profitability as they apply to SMT manufacturing.

Monday October 21, 2024 8:30am - 12:00pm CDT
Room 51

Professional Development Course

8:30am CDT

PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities

Monday October 21, 2024 8:30am - 12:00pm CDT

Room 44

PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Instructor: Jennie Hwang, Ph.D., H-Technologies Group

As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course also highlights what it takes to achieve AI with justified confidence.

Integrated with a variety of use cases, tips, and recommendations, the key components behind the AI technologies including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, and ChatGPT-led AI boom will be outlined, and “possible” AI future will be highlighted. All industry sectors are expected to reorient around AI; the ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!

Monday October 21, 2024 8:30am - 12:00pm CDT
Room 44

Professional Development Course

9:00am CDT

AME1: Additive Electronics Applications

Monday October 21, 2024 9:00am - 10:00am CDT

Room 47/49

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, Formerly with IBM Corporation

9:00am-9:30am
>>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP)
Mike Vinson, Electroninks
Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks

9:30am-10:00am
>>3D Aerosol Jet Printed Interconnects on Bare Die
*Tom Rovere, Lockheed Martin
Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin

Monday October 21, 2024 9:00am - 10:00am CDT
Room 47/49

Conference Session, AME Track

10:30am CDT

AME2: Processes for Additive Manufacturing

Monday October 21, 2024 10:30am - 12:00pm CDT

Room 47/49

Chair: Andy Behr, Panasonic
Co-Chair:

10:30am-11:00am
>>Sensors and Process-Performance Interactions for Additive In-Mold Electronics in Automotive Applications
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Hyesoo Jang, Ved Soni, Fatahi Musa, Md Golam Sarwar, Scott Miller, Auburn University

11:00am-11:30am
>>Current Minimum Micro Bump Size Using Gravure Offset Equipment
Douglas Schardt, Komori America Corp
Co-Authors: Shunichi Haraguchi, Chisato Oyama, Kotarou Usuda, Yoshihiro Ohyama, Ikeda Hideki, Komori Corporation

11:30am-12:00pm
>>Additive Manufactured Electronics for Next Generation Microelectronics
Kenneth Church, nScrypt, Inc.

Monday October 21, 2024 10:30am - 12:00pm CDT
Room 47/49

Conference Session, AME Track

12:00pm CDT

AME Keynote Presentation: Additively Manufactured Electronics - A View from The Ecosystem

Monday October 21, 2024 12:00pm - 1:00pm CDT

Room 47/49

Additively Manufactured Electronics: A View from The Ecosystem
Speaker: Arthur Wall, Ph.D., Director of Engineering and Fab Operations, NextFlex

Additive technology is changing our world. Simple 3D printed structures have evolved to become critical components in the manufacture of devices that we could not have imagined just a few years ago. Now comes the emergence of, the implementation of, and the continued evolution of, additive electronics. There are so many exciting examples of materials, tools, processes, and systems that are now emerging in the ecosystem indicating that this new technology cannot be ignored. More importantly, it is being adopted into manufacturing today. In this discussion, we will explore several well-known manufacturing approaches that push the boundaries of today’s capability and new entrants with innovative methods and materials. We will also describe the importance of additive electronics manufacturing for its impact ono environmental sustainability. Finally, future developments of systems and applications will be presented as part of an overall electronics national strategy.

Meet Art Wall
Art Wall is Director of Engineering and Fab Operations at NextFlex, managing the Technology Hub which houses multiple process tools for Additive and Flexible Hybrid Electronics development and prototyping. Prior to joining NextFlex, Art led many different groups and technologies associated with hard drive products for both IBM and Hitachi Global Storage Technologies. His most recent efforts prior to joining NextFlex were as a co-founder and Vice President of NuvoSun, an innovative photovoltaic company that was acquired by The Dow Chemical Company. Art has a Ph.D. in Materials Science from the University of Minnesota. Art has co-authored more than 30 articles in refereed journals, presented at more than 30 US and International Conferences, and holds 7 US patents.

Monday October 21, 2024 12:00pm - 1:00pm CDT
Room 47/49

Conference Session, AME Track

1:30pm CDT

AME3: Interconnects and Non-Conformal Additive Circuits

Monday October 21, 2024 1:30pm - 3:00pm CDT

Room 47/49

Chair: MP Divakar, Stack Design Automation
Co-Chair:

1:30pm-2:00pm
>>SMT Processing using Printed Anisotropic Conductive Epoxy for Direct Die Attach of Wire-bondable Chips on Flexible Additively Manufactured Electronics
Madhu Stemmerman, Sunray Scientific

2:00pm-2:30pm
>>Interconnecting and Soldering to Printed Ink Metallization Using Photonic Processes
Harry Chou, Ph.D., PulseForge
Co-Authors: Ogadimma John Okwuoma, Dave Pope, Ph.D., Ian Rawson, Ara Parsekian, Ph.D., PulseForge

2:30pm-3:00pm
>>In-Mold Electronics: An Additive Manufacturing Approach for Integrated, Robust and 3D Electronics
Rahul Raut, MacDermid Alpha Electronics Solutions
Co-Authors: Bawa Singh, NirmalyaKumar Chaki, Chetan Shah, Vasuki Kaushik, Supriya Devarajan, MacDermid Alpha Electronics Solutions

Monday October 21, 2024 1:30pm - 3:00pm CDT
Room 47/49

Conference Session, AME Track

1:30pm CDT

WLP: Invited Keynote Presentations & Panel

Monday October 21, 2024 1:30pm - 3:45pm CDT

Room 45

FREE FOR ALL ATTENDEES!
Chairs: Marie Cole, Formerly with IBM Corporation; Priyanka Dobriyal, Intel Corporation

>>AI Era - Work, Life, Technology, Leadership, and Women"
Jennie Hwang, Ph.D., H-Technologies Group

>>Coming soon!
Mandy Long, BigBear AI

>>Women Shaping SMTA: Past Contributions and Future Visions
The panel aims to highlight the contributions of remarkable women who have made significant impacts to the industry, championed diversity, and played pivotal roles in advancing SMTA while on the Board of Directors.
Panelists (Time Served on SMTA Board of Directors)
Moderator: Michelle Ogihara, Seika Machinery (2011-2016)
Debbie Carboni, KYZEN Corporation (2014-2020)
Marie Cole, IBM Corporation (2008-2013)
Priyanka Dobriyal, Ph.D. , Intel Corporation (2023-Current)
Eileen Hibbler, SMTA (2016-2018)
Tanya Martin, SMTA (Global Excutive Director)
Julie Silk, Keysight Technologies (2019-Current)
Frances Stewart, PCEA (1996-1998)

Monday October 21, 2024 1:30pm - 3:45pm CDT
Room 45

Women's Leadership Program

3:30pm CDT

AME4: Additive Electronics Manufacturing

Monday October 21, 2024 3:30pm - 5:00pm CDT

Room 47/49

Chair: MP Divakar, Stack Design Automation
Co-Chair:

3:30pm-4:00pm
>>Breaking Barriers: Advancing Electronics Tooling and Pallet Manufacturing with Additive Manufacturing
Jeff DeGrange, Impossible Objects
Co-Author: Dan Migely, Impossible Objects

4:00pm-4:30pm
>>Supercooled Solder Pastes in Low Temperature Attach Applications
Yifan Wu, Ph.D., Indium Corporation
Co-Authors: Ian Tevis, Radhika Jadhav, Indium Corporation

4:30pm-5:00pm
>>AI-Powered Real-Time Inspection for Electronic Component Assembly
Sean Bouskila, Cybord
Co-Author: Eyal Weiss, Cybord

Monday October 21, 2024 3:30pm - 5:00pm CDT
Room 47/49

Conference Session, AME Track

4:00pm CDT

WLP: Round Table Discussion- Past Innovations, Present Challenges, and Future Trends in Electronics Manufacturing

Monday October 21, 2024 4:00pm - 5:00pm CDT

Room 45

FREE FOR ALL ATTENDEES
Join experts and fellow attendees to explore the evolution and innovation of the different electronics manufacturing sectors. Topics include:

>>Past, Present, and Future of Soldering
Hosted by: Gayle Towell, AIM Solder

>>Past, Present, and Future of Cleaning/High Reliability

>>Past, Present, and Future of Marketing/Sales
Hosted by: Stephanie Austin, Zentech Manufacturing

>>Past, Present and Future of Research & Development

>>Past, Present and Future of Green Energy/Sustainability

Monday October 21, 2024 4:00pm - 5:00pm CDT
Room 45

Women's Leadership Program

5:00pm CDT

WLP: Connection Reception

Monday October 21, 2024 5:00pm - 6:00pm CDT

Room 45

FREE FOR ALL ATTENDEES

Join the Women's Leadership Program as we mingle with drinks and nibbles with fellow attendees!
More details coming soon….

Monday October 21, 2024 5:00pm - 6:00pm CDT
Room 45

Women's Leadership Program

8:30am CDT

INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 44

Chair:
Co-Chair:

8:30am-9:00am
>>Machine Vision-Based Plated Through Hole Defect Inspection Model for Large-Scale PCB Manufacturing Industries
Jinal Prajapati, Watson Institute for System Excellence, Binghamton University
Co-Authors: Soujanya Nagaraja Rao Malur, Prashanth Tamilselvam, Darshil Patel, Daryl Santos, Watson Institute for System Excellence, Binghamton University

9:00am-9:30am
>>Artificial Intelligence and its Role in Improving Automated Optical Inspection
Edward Pechin, Vitrox USA

9:30am-10:00am
>>Machine Learning-Based Server Testing and Debugging Model for Large-Scale PCB Manufacturing Industries
Soujanya Nagaraja Rao Malur, Binghamton University
Co-Authors: Aditya Shobhawat, Foxconn Industrial Internet; Darshil Rajeshkumar Patel, Daryl Santos, Ph.D., Watson Institute for Systems Excellence, Binghamton University

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 44

Conference Session, INS Track

8:30am CDT

MFX1: Reliability Challenges

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 48

Chair: Maria Tanasescu, AMD
Co-Chair:

8:30am-9:00am
>>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies
Kunal Shah, Ph.D., Lilotree

9:00am-9:30am
>>DRAM Damage Due to X-Ray Inspections Post PCB Assembly
Surabh Gupta, Ph.D., Intel Corporation

9:30am-10:00am
>>Case Studies of Harsh Application Environments, the Unforeseen Situations
*Christopher Genthe, *Kelly Flanagan, Rockwell Automation

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48

Conference Session, MFX Track

8:30am CDT

RHE1: Solder Joint Reliability

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 47/49

Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.

8:30am-9:00am
>>The Effect of Thermal Cycling Dwell Time on Reliability of High-Performance Pb-free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

9:00am-9:30am
>>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature
Mathias Nowottnick, University of Rostock
Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock

9:30am-10:00am
>> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies
*Anna Lifton, Macdermid Alpha Electronics Solutions
Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 47/49

Conference Session, RHE Track

8:30am CDT

PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods

Tuesday October 22, 2024 8:30am - 12:00pm CDT

Room 45

PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Instructor: Michael Vinson, Electroninks

This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication.
Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.

Tuesday October 22, 2024 8:30am - 12:00pm CDT
Room 45

Professional Development Course

8:30am CDT

SMT Processes Certification Course

Tuesday October 22, 2024 8:30am - Thursday October 24, 2024 5:00pm CDT

Room 57

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.

Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE.

Schedule
Tuesday, October 22 - Course (8:30am-5:00pm)
Wednesday, October 23 - ½ day of course + exam (8:30am-5:00pm)
Thursday, October 24 - All day exam (8:30am-5:00pm)

Registration Fees (pricing in USD)
Member: $1300
Non-Member: $1500
*Includes test and study guide with workshop
Register Here: https://smta.org/events/EventDetails.aspx?id=1796342&group=

Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting

Questions?
SMTA Certification
certification@smta.org

Tuesday October 22, 2024 8:30am - Thursday October 24, 2024 5:00pm CDT
Room 57

Certification

10:30am CDT

INS2: Unique Materials and Lab-Based Inspection & Test Applications

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 44

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

10:30am-11:00am
>>Using True 3D to Optimize Your Dispensing Process: A Journey Toward Zero Defects
Daniel Perry, Koh Young Technology, Inc.

11:00am-11:30am
>>Calibration of Tweezer Meters Enabling Sub-1pF and Sub-1nH Measurements
Michael Obrecht, Ph.D., Siborg Systems Inc

11:30am-12:00pm
>>A Survey of the Sources of Ionic Contamination as Measured by Ion Chromatography during Electronics Manufacturing
*Adam Klett, Ph.D., KYZEN Corporation
Co-Authors: Ram Wissel, James Perigen, KYZEN Corporation

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 44

Conference Session, INS Track

10:30am CDT

MFX2: Large Panel Assembly

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 48

Chair:
Co-Chair:

10:30am-11:00am
>>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond
*Paul Wang, Ph.D., MiTAC Computer Technology
Co-Author: Dennis Willie, Flex

11:00am-11:30am
>>Large Form Factor Surface Mount Technology Process Demonstration
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation

11:30am-12:00pm
>>Examination of Cutting Edge Quality and the Influences of Laser Depaneling
Jake Benz, LPKF Laser & Electronics North America
Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

11:00am CDT

RHE2: Reliability Aspects of High Performance Components

Tuesday October 22, 2024 11:00am - 12:00pm CDT

Room 47/49

Chair:
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination
Victoria Delissio, Heraeus Electronics

11:30am-12:00pm
>>Board Level Reliability Testing of RF Packages
Mumtaz Bora, Psemi

Tuesday October 22, 2024 11:00am - 12:00pm CDT
Room 47/49

Conference Session, RHE Track

1:00pm CDT

INS3: Evolution and Trends in Current Xray Inspection Applications & Technology

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

1:00pm-1:30pm
>>Review of the Latest Developments of the Xray Inspection Technology for PCBAs and Microelectronics Designs
Evstatin Krastev, Ph.D., Nordson

1:30pm-2:00pm
>>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection
Nick Fieldhouse, M.S., Omron Inspection Systems

2:00pm-2:30pm
>>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control
Eric McElmurry, Viscom USA

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 44

Conference Session, INS Track

1:00pm CDT

MFX3: Design and Sustainability

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 48

Chair: Jon Ashton, CSMTPE, Universal Instruments
Co-Chair: Mei-Ming Khaw, Keysight Technologies

1:00pm-1:30pm
>>Sustainable and Strategic Design to Combat Component Unavailability
*Kathryn Ackerman, Sourceability

1:30pm-2:00pm
>>Design for Manufacturability - Perspectives from a Manufacturing Engineer
David Spitz, Ansys, Inc.

2:00pm-2:30pm
>>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process
Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University
Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

RHE3: Reliability and Cleanliness

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 47/49

Chair:
Co-Chair: Doug Pauls, Collins Aerospace

1:00pm-1:30pm
>>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments
*Mike Konrad, Aqueous Technologies

1:30pm-2:00pm
>>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board
Donghyun Kim, Ph.D., Nokia Bell Labs
Co-Author: Chen Xu, Nokia Bell Labs

2:00pm-2:30pm
>>A New Approach to Process Qualification – SIR Testing + Functional Components
*Mike Bixenman, MBA, DBA, Magnalytix LLC
Co-Authors: Terry Munson, Foresite

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 47/49

Conference Session, RHE Track

3:00pm CDT

INS4: Challenging AOI Applications

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

3:30pm-4:00pm
>>Pre- and Post-Solder AOI for THT
John Johnson, EAP

4:00pm-4:30pm
>>Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys
Gayle Towell, AIM Solder
Co-Authors: Timothy O’Neill, Carlos Tafoya, Andres Lozoya, AIM Solder; Nick Fieldhouse, Omron Inspection Systems

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 44

Conference Session, INS Track

3:00pm CDT

MFX4: Solder Pastes and Interconnection Materials

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 48

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48

Conference Session, MFX Track

3:00pm CDT

RHE4: Thermal Shock & Thermal Cycle Testing Comparisons

Tuesday October 22, 2024 3:00pm - 4:30pm CDT

Room 47/49

Chair: David Hillman, Hillman Electronic Assembly Solutions
Co-Chair: Chloe Feng, Nokia Bell Labs

3:30pm-4:00pm
>>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints
*Jayse McLean, John Deere Intelligent Solutions Group

4:00pm-4:30pm
>>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points
*Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering

4:30pm-5:00pm
>>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

Tuesday October 22, 2024 3:00pm - 4:30pm CDT
Room 47/49

Conference Session, RHE Track

3:30pm CDT

Electronics Manufacturing Assembly Collaborative: Workforce Development Efforts

Tuesday October 22, 2024 3:30pm - 5:00pm CDT

Room 50/51

Introducing the Electronics Manufacturing Assembly Collaborative for Workforce Development (EMAC)!

The objective of this initiative is to provide a collaborative resource to connect academia, manufacturers, workers, and job seekers with education programs to develop skills for careers in electronic manufacturing. This session will share success stories, promote best practices and foster innovation. Join us in shaping the future of workforce development and advancing the electronics manufacturing sector.

Tuesday October 22, 2024 3:30pm - 5:00pm CDT
Room 50/51

Workforce Development, EMAC

4:00pm CDT

Electronics Exhibition

Tuesday October 22, 2024 4:00pm - 7:00pm CDT

Exhibit Halls D and C

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibition
Tuesday Hours: 4:00pm-7:00pm

We are excited to announce that SMTA International is returning to Rosemont, IL! The exhibition will be co-located with The ASSEMBLY SHOW. With this partnership, we are bringing together all aspects of the engineering and electronics manufacturing industry!

Tuesday October 22, 2024 4:00pm - 7:00pm CDT
Exhibit Halls D and C

Exhibition

5:00pm CDT

Passport Program Launch (Interactive Expo Networking Event)

Tuesday October 22, 2024 5:00pm - 6:00pm CDT

SMTA Booth #2853

Meet Manufacturing Technology Experts on the Expo Floor

Calling all young professionals and those new to the industry! Join us at SMTA International during our interactive in-expo networking event, Passport to the World of SMT!
*2024 program details will be announced soon

Tuesday October 22, 2024 5:00pm - 6:00pm CDT
SMTA Booth #2853

Students & Young Professionals

8:00am CDT

SMTA Annual Meeting

Wednesday October 23, 2024 8:00am - 8:30am CDT

Room 104

FREE to All Attendees!

Join us for the SMTA Annual Meeting, hosted by newly elected SMTA President, Greg Vance. This annual gathering serves as a pivotal moment for our association, as we come together to reflect on our journey, unveil new projects, and carve the future of the Surface Mount Technology Association. With current Global Board of Director's leadership, our association has thrived, and this meeting will offer members a unique opportunity to gain insights into our achievements, challenges, and future goals.

Wednesday October 23, 2024 8:00am - 8:30am CDT
Room 104

Special Event

9:00am CDT

SMTAI Keynote Presentation: Crafting the Future- Leadership and Legacy in the Manufacturing Industry

Wednesday October 23, 2024 9:00am - 10:00am CDT

Room 1 - Level 1

FREE to All Attendees!
Crafting the Future: Leadership and Legacy in the Manufacturing Industry
Speaker: Jairek Robbins, Author, Speaker, Coach
Location: Room: 1 | Level 1 of the DES Convention Center

This is more than just a keynote—it’s a call to action to shape your career and the future of manufacturing. Don’t miss it!

Are you ready to tackle the most pressing challenges in the manufacturing industry and lead your organization into a prosperous future? Join Jairek Robbins at SMTA International for a dynamic keynote that will not only address the workforce shortages and retention issues but also inspire a new generation to join the manufacturing ranks. In an industry where over 1 million jobs remain unfilled, Jairek will share actionable strategies on how to attract and retain young talent, foster and thrive in a culture of innovation, and build a legacy that you can be proud of. This keynote is your opportunity to learn how to create an environment where you are motivated, actively contribute, and are excited about the future of manufacturing.

This session will empower you with the tools and mindset needed to drive your career toward excellence. Jairek will delve into the critical role of leadership in transforming workplaces, the benefits of performance coaching, and how to activate the very best in yourself and those around you. This keynote will provide you with the insights needed to navigate the evolving landscape of manufacturing with confidence and optimism.

Meet Jairek Robbins:
He is a Best-Selling author. FastCompany calls him inspiring and says he’ll make your life less ordinary. Forbes says Jairek will teach you how to succeed. Deepak Chopra will advise you to go to Jairek to help create meaning and fulfillment in your life. Brian Tracy applauds Jairek’s ability to teach people how to develop meaning and purpose in life and then to make a difference in the lives of others—looking for ways to level up in life and business. Jairek is your guy. Let’s get started.

Wednesday October 23, 2024 9:00am - 10:00am CDT
Room 1 - Level 1

Special Event

10:00am CDT

Electronics Exhibition

Wednesday October 23, 2024 10:00am - 5:00pm CDT

Exhibit Halls D and C

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibition
Wednesday Hours: 10:00am-5:00pm

We are excited to announce that SMTA International is returning to Rosemont, IL! The exhibition will be co-located with The ASSEMBLY SHOW. With this partnership, we are bringing together all aspects of the engineering and electronics manufacturing industry!

Wednesday October 23, 2024 10:00am - 5:00pm CDT
Exhibit Halls D and C

Exhibition

10:00am CDT

Ultra HDI Learning Pavilion Technical Program

Wednesday October 23, 2024 10:00am - 5:00pm CDT

UHDI Pavillion Booth #2753

Free to all attendees!
Wednesday, October 23 - Thursday, October 24
Show Floor - UHDI Pavillion Booth #2753

Join us at the first-of-its-kind Ultra HDI Pavilion, where industry leaders will converge to explore the cutting-edge advancements in Ultra-High Density Interconnect (UHDI) technology. Explore a comprehensive schedule packed with technical sessions covering everything from The SMTA Ultra-HDI Test Board design to fabrication materials, assembly processes, and strategies to address continued miniaturization. A highlight you can't miss is the "Lab to Fab" working session, designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production. Whether you're looking to stay ahead of the curve or shape the future of miniaturization, the Ultra HDI Pavilion is where you need to be.

10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
10:30-11:15: Guest Speaker, "Demand and Why We Need UHDI"
11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
12:30-12:50: Greg Smith, Blue Ring, "Stencil"
1:00-1:20: Gayle Towell, Aim Solder, "Materials (Ultra Fine Powders)"
1:30-1:50: Guest Speaker, “Inspection”
2:00-2:20: Guest Speaker, “Component Placement”
2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
3:00-4:00: Elliott Fowler, Sandia National Laboratories; Chrys Shea, Shea Engineering, "Lab to Fab - Working Session“

Wednesday October 23, 2024 10:00am - 5:00pm CDT
UHDI Pavillion Booth #2753

Free Show Floor Presentations, UHDI Pavillion

10:30am CDT

40 Under 40 Awards Ceremony

Wednesday October 23, 2024 10:30am - 11:30am CDT

SMTA Booth #2853

Recognize young leaders in the industry! In celebration of SMTA's 40th Anniversary, we are hosting the SMTA's 40 Under 40 Program to recognize young leaders who have demonstrated outstanding success in their careers and contributions to the electronics manufacturing industry.

Wednesday October 23, 2024 10:30am - 11:30am CDT
SMTA Booth #2853

Students & Young Professionals

11:00am CDT

APT1: Innovations in Wafer Level and Fan-Out Packaging

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Room 45

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 45

Conference Session, APT Track

11:00am CDT

MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Room 48

Chair:
Co-Chair:

11:00am-11:30am
>>Electronic Assembly Rework Best Practices When Building to a No-Clean and Cleaning Conditions
*Mike Bixenman, MBA, DBA, Magnalytix, LLC
Co-Authors: J.D. Buller, AIR-VAC

11:30am-12:00pm
>>An Investigation in Rinse Water Sustainability
*Ram Wissel, KYZEN Corporation
Co-Author: Rod Chilton, ITW EAE

12:00pm-12:30pm
>>A Case Study on Assembly Process Optimization of 0201 BTC Diodes for High Temperature Reflow
Prathik Rudresh, Vicor Power
Co-Author: Chrys Shea, Shea Engineering Services

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 48

Conference Session, MFX Track

11:15am CDT

Knowledge Nugget Session on the Show Floor

Wednesday October 23, 2024 11:15am - 2:45pm CDT

SMTA Booth #2853

Free to all attendees!
Wednesday, October 23
Show Floor - SMTA Booth #2853

*Speakers to be announced

11:15 12:45: SMT Basics
ESD - Thomas Ricciardelli, StaticStop a division of SelecTech, Inc.
Soldering Materials - Tony Lentz, FCT Solder
Thermal Management - Miles Moreau, KIC
Cleaning - Mike Konrad, Aqueous Technologies
PCB Fabrication - Anaya Vardya, American Standard Circuits, Inc.

1:15 1:45: Supply Chain
Speaker TBD, Screaming Circuits

2:00 2:45: From Fab to Assembly
Speaker TBD, Screaming Circuits
John Johnson, ASC

Wednesday October 23, 2024 11:15am - 2:45pm CDT
SMTA Booth #2853

Free Show Floor Presentations, Nugget

11:30am CDT

LTS1: Thermal Fatigue Reliability

Wednesday October 23, 2024 11:30am - 12:30pm CDT

Room 44/46

Chair: Francis Mutuku, Indium Corporation
Co-Chair:

11:30am-12:00am
>>Thermal Cycle Fatigue Life of Low Temperature Solders
*Michael Osterman, CALCE/University of Maryland
Co-Author: Aaron Mendelsohn, CALCE/University of Maryland

12:00pm-12:30pm
>>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project

Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 44/46

Conference Session, LTS Track

11:30am CDT

RHE5: Aspects of Reliability Modeling

Wednesday October 23, 2024 11:30am - 12:30pm CDT

Room 47/49

Chair: Laura Cohen, Woodward
Co-Chair:

11:30am-12:00pm
>>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

12:00pm-12:30pm
>>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals

Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 47/49

Conference Session, RHE Track

12:00pm CDT

Interactive Presentations on the Show Floor

Wednesday October 23, 2024 12:00pm - 2:00pm CDT

Exhibit Halls D and C

Free to all attendees!

Explore a showcase of innovative projects, products, and research at the SMTAI interactive presentation session. Industry experts and students will present their latest technologies and findings, providing insights into the future of electronics manufacturing. This interactive session offers a great opportunity to network, learn about emerging trends, and engage in discussions with your industry peers.

Poster Submissions:
Aurelio Castro, SAIC, “Self-Sintered Electrically Conductive Materials”
Sean Dennehe, SAIC, “Self-Sintered Dielectric Materials”
Riley Gawronski, SAIC, “Self-Sintered Thermal Interface Materials”
Benjamin Keppers, Michigan Tech/SAIC, “Self-Sintered Thermal Interface Materials”
Michael Maurer, Warrant Technologies/Michigan Technological University, “Organic Substrate Phased Array Electro-Optic Antennas”
Christopher Middlebrook, Michigan Tech/SAIC, “"Workforce Development: Student Exposure to Careers in Electronics Manufacturing through a University Lecture and Laboratory for Fabrication of Printed Circuit Boards"
Qais Qasaimeh, Auburn University, "Machine Learning in Predicting Solder Joint Time-to-Failure During Thermal Cycling Reliability Test"
Attila Rektor, Boise State University/SAIC, "Nanoparticle Modification of Laser-Induced Graphene for Electroless Copper Deposition"

Wednesday October 23, 2024 12:00pm - 2:00pm CDT
Exhibit Halls D and C

Special Event

2:00pm CDT

APT2: Technological Advancements and System Solutions

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 45

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Innovative Intelligent System Architectures for Heterogeneous Integration Assembly
Gregg Taran, Universal Instruments
Co-Author: Glenn Farris, Universal Instruments

2:30pm-3:00pm
>>Making Cost-effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

3:00pm-3:30pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 45

Conference Session, APT Track

2:00pm CDT

MFX6: Cleaning Challenges and Solutions

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 48

Chair:
Co-Chair:

2:00pm-2:30pm
>>Cleaning Under Bottom Terminated Components - Importance of Good Rinsing
*Vladimir Sitko, PBT Works s.r.o.
Co-Author: Mike Bixenmann, MBA, DBA, Magnalytix, LLC

2:30pm-3:00pm
>>Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
*Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; *Patrick Lawrence, ITW EAE; *Evan Griffith, Indium Corporation

3:00pm-3:30pm
>>Using Technical Cleanliness Assessments to Reduce Manufacturing Defect
Shelia Hamilton, Teknek

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 48

Conference Session, MFX Track

2:00pm CDT

RHE6: Printed Circuit Board Considerations

Wednesday October 23, 2024 2:00pm - 3:30pm CDT

Room 47/49

Chair:
Co-Chair: Albert Wu, National Central University Taiwan

2:00pm-2:30pm
>>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
Agustin Vasquez, Ph.D., Intel Corporation
Co-Authors: Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Corporation

2:30pm-3:00pm
>>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
Saddam Daradkeh, Ph.D., Auburn University
Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University

3:00pm-3:30pm
>>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling
Miles Moreau, KIC
Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 47/49

Conference Session, RHE Track

3:30pm CDT

Ice Cream Social Hosted by The Great Lakes & Wisconsin Chapters

Wednesday October 23, 2024 3:30pm - 4:30pm CDT

SMTA Booth #2853

Join us for networking with a sweet twist at this Ice Cream Social, hosted by the SMTA Great Lakes Chapter!
Whether you're a seasoned professional or new to the industry, this event is a great opportunity to connect with like-minded individuals, forge new connections, and discover how the SMTA can support your professional journey.

Wednesday October 23, 2024 3:30pm - 4:30pm CDT
SMTA Booth #2853

Special Event

5:00pm CDT

SYP Happy Hour

Wednesday October 23, 2024 5:00pm - 6:00pm CDT

Murray Brothers Caddyshack

Join SMTA for a Happy Hour to celebrate young leaders and their contributions to the electronics manufacturing industry.
*Murray Brothers Caddyshack is located on the lobby level in Crowne Plaza Chicago O'Hare Hotel and Conference Center

Wednesday October 23, 2024 5:00pm - 6:00pm CDT
Murray Brothers Caddyshack 9546 Balmoral Ave., Rosemont, IL 60018

Students & Young Professionals

6:30pm CDT

Back to 1984: Celebrating 40 Years (SMTA Anniversary Party)

Wednesday October 23, 2024 6:30pm - 9:00pm CDT

Kings Rosemont

Step into a time warp and buckle up for a journey back to the raddest era of them all! The Association's 40-year anniversary party at SMTA International is not just a celebration; it's a gnarly 80s extravaganza that'll leave non-attendees stuck in the wrong decade.

Good vibes required - costumes encouraged!
*Purchase tickets when completing your SMTAI registration

Wednesday October 23, 2024 6:30pm - 9:00pm CDT
Kings Rosemont 5505 Park Place, Rosemont, IL 60018

Special Event

8:30am CDT

APT3: Package Modeling and Simulation

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 45

Chair: Burt Carpenter, NXP Semiconductors
Co-Chair:

8:30am-9:00am
>>The Next Generation of Si-Interposers
*Charles Woychik, Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

9:00am-9:30am
>>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University

9:30am-10:00am
>>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies
Josh Akman, Ansys
Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 45

Conference Session, APT Track

8:30am CDT

LTS2: Electromigration in Tin-Bismuth Solders

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 44/46

Chair: Vasu Vasudevan, Dell
Co-Chair:

8:30am-9:00am
>>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints
*Prabjit Singh, Ph.D., IBM Corporation
Co-Authors: See paper for full listing

9:00am-9:30am
>>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints
*Kevin Byrd, Intel Corporation
Co-Authors: Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation

9:30am-10:00am
>>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
Alyssa Yaeger, Ph.D., Universal Instruments
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 44/46

Conference Session, LTS Track

8:30am CDT

RHE7: Pb-free Solder Alloy Reliability

Thursday October 24, 2024 8:30am - 10:00am CDT

Room 47/49

Chair: Maurice Dore, Valeo
Co-Chair:

8:30am-9:00am
>>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish
Alakayleh Abdallah, Auburn University
Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University

9:00am-9:30am
>>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy
*Anna Lifton, MacDermid Alpha Electronics
Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University

9:30am-10:00am
>>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys
Menghong Wang, Ph.D., Auburn University
Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University

Thursday October 24, 2024 8:30am - 10:00am CDT
Room 47/49

Conference Session, RHE Track

9:00am CDT

MFX7: SIR Practical Studies

Thursday October 24, 2024 9:00am - 10:00am CDT

Room 48

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

9:00am-9:30am
>>Aerosol Jet Printing, A Promising Emerging Technology for Printed Electronics (Potential SIR Patterns)
Jaime Regis, Ph.D., Honeywell FM&T

9:30am-10:00am
>>Aerosol Printing SIR Patterns on Real World Components. The Potential for Value-Added Real-World Data
Jaime Regis, Ph.D., Honeywell FM&T

Thursday October 24, 2024 9:00am - 10:00am CDT
Room 48

Conference Session, MFX Track

9:00am CDT

Electronics Exhibition

Thursday October 24, 2024 9:00am - 2:00pm CDT

Exhibit Halls D and C

See full exhibitor listing and floorplan here: https://www.smtai.org/exhibition
Thursday Hours: 9:00am-2:00pm

We are excited to announce that SMTA International is returning to Rosemont, IL! The exhibition will be co-located with The ASSEMBLY SHOW. With this partnership, we are bringing together all aspects of the engineering and electronics manufacturing industry!

Thursday October 24, 2024 9:00am - 2:00pm CDT
Exhibit Halls D and C

Exhibition

10:00am CDT

Ultra HDI Learning Pavilion Technical Program

Thursday October 24, 2024 10:00am - 1:00pm CDT

UHDI Pavillion Booth #2753

Thursday October 24, 2024 10:00am - 1:00pm CDT
UHDI Pavillion Booth #2753

Free Show Floor Presentations, UHDI Pavillion

10:15am CDT

Innovating Education Session: Exploring a New Video Course Format

Thursday October 24, 2024 10:15am - 10:45am CDT

SMTA Booth #2853

Free to all attendees!
Thursday, October 24
Show Floor - SMTA Booth #2853

More session information coming soon!

Speakers:
Gayle Towell, AIM Solder
Lavanya Ashok Swaminathan, Rochester Institute of Technology

Thursday October 24, 2024 10:15am - 10:45am CDT
SMTA Booth #2853

Free Show Floor Presentations, Education Session

10:30am CDT

RHE8: Material Specifications for High Performance

Thursday October 24, 2024 10:30am - 11:30am CDT

Room 47/49

Chair: Laura Cohen, Woodward
Co-Chair:

10:30am-11:00am
>>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems
*Michael Osterman, CALCE

11:00am-11:30am
>>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
Rita Mohanty, Ph.D., Henkel Electronics
Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation

Thursday October 24, 2024 10:30am - 11:30am CDT
Room 47/49

Conference Session, RHE Track

10:30am CDT

APT4: Advanced Materials and Process 1

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 45

Chair: Charles Woychik, Nhanced Semiconductors
Co-Chair:

10:30am-11:00am
>>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV)
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.

11:00am-11:30am
>>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste
Albert Wu, National Central University
Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.

11:30am-12:00pm
>>Non-toxic Stabilization for Mixed Reaction Gold
Sandra Nelle, Atotech Deutschland GmbH & Co. KG
Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 45

Conference Session, APT Track

10:30am CDT

LTS3: Unique Low Temp Soldering Processes and Quality Control Methods

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 44/46

Chair: Prabjit Singh, Ph.D., IBM Corporation
Co-Chair:

10:30am-11:00am
>>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions
*Kevin Byrd, Intel Corporation
Co-Authors: Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation

11:00am-11:30am
>>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components
Watson Tseng, Shenmao Technology Inc.

11:30am-12:00pm
>>Unique Quality Control for The Success in Product Level Certification of Low Temperature Soldering with SnBi Based Alloy
Kok Kwan Tang, TechLeap

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 44/46

Conference Session, LTS Track

10:30am CDT

MFX8: Solder Processes

Thursday October 24, 2024 10:30am - 12:00pm CDT

Room 48

Chair: Maurice Dore, Valeo
Co-Chair:

10:30am-11:00am
>>Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
*Evan Griffith, Indium Corporation
Co-Authors: David Heller, Xike Zhao, Phil Lehrer, Heller Industries

11:00am-11:30am
>>Reduction of Condensate Residues in the Reflow Process by Targeted Control of Chemical Reactions
*Viktoria Rawinski, Rawinski GmbH

11:30am-12:00pm
>>How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance
*Westin Bent, MacDermid Alpha Electronics Solutions
Co-Authors: Jennifer Fijalkowski, Geoffrey Post, MacDermid Alpha Electronics Solutions; Shinichi Kitamiya, Ken Takahashi, Japan Unix

Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

12:30pm CDT

SMTA Workforce Development Collaborative

Thursday October 24, 2024 12:30pm - 1:00pm CDT

SMTA Booth #2853

Free to all attendees!
Thursday, October 24
Show Floor - SMTA Booth #2853

More information coming soon!

Thursday October 24, 2024 12:30pm - 1:00pm CDT
SMTA Booth #2853

Workforce Development

1:00pm CDT

MFX9: Printing and Printing Processes

Thursday October 24, 2024 1:00pm - 2:00pm CDT

Room 48

Chair:
Co-Chair:

1:00pm-1:30pm
>>Meeting the Challenges of Ultra-fine Feature Printing and Reflow Through Optimization of Pb-free Solder Paste
*Tony Lentz, FCT Solder

1:30pm-2:00pm
>>Investigation of Overprinting BGA Pads: It Should Print Better Than This!
Jeff Schake, ASMPT

Thursday October 24, 2024 1:00pm - 2:00pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

APT5: Advanced Materials and Process 2

Thursday October 24, 2024 1:00pm - 2:30pm CDT

Room 45

Chair: Dale Lee, Plexus Corp.
Co-Chair:

1:00pm-1:30pm
>>Beyond the Technical Data Sheet
Deborah Hagen, Ph.D., Sandia National Labs
Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs

1:30pm-2:00pm
>>2nd Generation of TIM
Mina Yaghmazadeh, Ph.D., SJ Electronics
Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics

2:00pm-2:30pm
>>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material
Rita Mohanty, Ph.D., Henkel Corporation
Co-Author: Blake Wageman, Henkel Corporation

Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 45

Conference Session, APT Track

1:00pm CDT

LTS4: Innovative LTS Material and Process Developments to Overcome Assembly

Thursday October 24, 2024 1:00pm - 2:30pm CDT

Room 44/46

Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology
Co-Chair:

1:00pm-1:30pm
>>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS
*Francis Mutuku, Indium Corporation
Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation

1:30pm-2:00pm
>>Wave Soldering the Lower Temperature Solder- A Case Study
*Keith Sweatman, Nihon Superior Co., Ltd
Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland

2:00pm-2:30pm
>>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits
*Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation

Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 44/46

Conference Session, LTS Track