8:30am-9:00am >>The Next Generation of Si-Interposers *Charles Woychik, Ph.D., Nhanced Semiconductors Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida
9:00am-9:30am >>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock *Pradeep Lall, Ph.D., Auburn University Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University
9:30am-10:00am >>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies Josh Akman, Ansys Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 45
8:30am-9:00am >>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints *Prabjit Singh, Ph.D., IBM Corporation Co-Authors: See paper for full listing
9:00am-9:30am >>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints *Raiyo Aspandiar, Ph.D., Intel Foundry Co-Authors: Kevin Byrd, Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation
9:30am-10:00am >>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance Alyssa Yaeger, Ph.D., Universal Instruments Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 44
Chair: Keith Bryant, KB Consultancy Co-Chair: Laura Cohen, Woodward
8:30am-9:00am >>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems *Michael Osterman, CALCE
9:00am-9:30am >>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy *Anna Lifton, MacDermid Alpha Electronics Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University
9:30am-10:00am >>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys Menghong Wang, Ph.D., Auburn University Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University
10:00am-10:30am >>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use Rita Mohanty, Ph.D., Henkel Electronics Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation
Thursday October 24, 2024 8:30am - 10:30am CDT
Room 49
Chair: Prabjit Singh, Ph.D., IBM Corporation Co-Chair:
10:30am-11:00am >>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions *Raiyo Aspandiar, Ph.D., Intel Foundry Co-Authors: Kevin Byrd, Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation
11:00am-11:30am >>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components Watson Tseng, Shenmao Technology Inc.
Thursday October 24, 2024 10:30am - 11:30am CDT
Room 44
Chair: Charles Woychik, Ph.D., Nhanced Semiconductors Co-Chair: Michelle Brown, Continental
10:30am-11:00am >>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV) Yoshinori Ejiri, Resonac Co., Ltd. Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.
11:00am-11:30am >>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste Albert Wu, National Central University Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.
11:30am-12:00pm >>Non-Toxic Stabilization for Mixed Reaction Gold Joe McGurran, Atotech Deutschland GmbH & Co. KG Co-Authors: Sandra Nelle, Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG
Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 45
10:30am-11:00am >>Meeting the Challenges of Ultra-fine Feature Printing and Reflow Through Optimization of Pb-free Solder Paste *Tony Lentz, FCT Solder
11:00am-11:30am >>Investigation of Overprinting BGA Pads: It Should Print Better Than This! Jeff Schake, ASMPT
11:30am-12:00pm >>Aerosol Jet Printing SIR Patterns on Real World Components: The Potential for Value-Added Real-World Data Jaime Regis, Ph.D., Honeywell FM&T
Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 48
1:00pm-1:30pm >>Beyond the Technical Data Sheet Deborah Hagen, Ph.D., Sandia National Labs Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs
1:30pm-2:00pm >>2nd Generation of TIM Mina Yaghmazadeh, Ph.D., SJ Electronics Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics
2:00pm-2:30pm >>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material Rita Mohanty, Ph.D., Henkel Corporation Co-Author: Blake Wageman, Henkel Corporation
Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 45
1:00pm-1:30pm >>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS *Francis Mutuku, Indium Corporation Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation
1:30pm-2:00pm >>Wave Soldering the Lower Temperature Solder- A Case Study *Keith Sweatman, Nihon Superior Co., Ltd Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland
2:00pm-2:30pm >>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits *Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation
Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 44
