8:30am-9:00am >>The Next Generation of Si-Interposers *Charles Woychik, Nhanced Semiconductors Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida
9:00am-9:30am >>Potted Assembly Interfacial Reliability and Predictive Models Under Inclined 25000g Mechanical Shock *Pradeep Lall, Ph.D., Auburn University Co-Authors: Aathi Pandurangan, Padmanava Choudhury, Ken Blecker, Auburn University
9:30am-10:00am >>Numerical Modeling of Board Warpage During Solder Reflow: a Comparison of PCB Modeling Methodologies Josh Akman, Ansys Co-Author: Tyler Ferris, Micah Hernandez, and Michael Blattau, Ansys Inc.
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 45
8:30am-9:00am >>Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints *Prabjit Singh, Ph.D., IBM Corporation Co-Authors: See paper for full listing
9:00am-9:30am >>Progress in the Understanding and Prediction of Bismuth Electromigration in Functional Motherboard Solder Joints *Kevin Byrd, Intel Corporation Co-Authors: Brian Franco, Yunfei Wang, Jacob Schichtel, Intel Corporation
9:30am-10:00am >>Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance Alyssa Yaeger, Ph.D., Universal Instruments Co-Authors: Michael Meilunas, Universal Instruments Corporation; Tahat, Sufyan, Auburn University
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 44/46
8:30am-9:00am >>Thermal Cycling Reliability of Third-Generation Alloys Considering the Effect of Solder Paste Volume and Surface Finish Alakayleh Abdallah, Auburn University Co-Authors: Mohamed El Amine Belhadi, John Evans, Sa’d Hamasha, Ph.D., Auburn University
9:00am-9:30am >>Unraveling the Next-Generation High-Reliability Lead-Free Solder Alloy *Anna Lifton, MacDermid Alpha Electronics Co-Authors: Pritha Choudhury, Ph.D., Morgana Ribas, Prathap Augustine, Siuli Sarkar, Paul Salerno, MacDermid Alpha Electronics Solutions; Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, Purdue University
9:30am-10:00am >>Thermal Cycling and Drop Shock Test Program for Defense-Purpose High Performance Lead-Free Solder Alloys Menghong Wang, Ph.D., Auburn University Co-Authors: Mohamed El Amine Belhadi, Sa’d Hamasha, Ph.D., Auburn University
Thursday October 24, 2024 8:30am - 10:00am CDT
Room 47/49
9:00am-9:30am >>Aerosol Jet Printing, A Promising Emerging Technology for Printed Electronics (Potential SIR Patterns) Jaime Regis, Ph.D., Honeywell FM&T
9:30am-10:00am >>Aerosol Printing SIR Patterns on Real World Components. The Potential for Value-Added Real-World Data Jaime Regis, Ph.D., Honeywell FM&T
Thursday October 24, 2024 9:00am - 10:00am CDT
Room 48
We are excited to announce that SMTA International is returning to Rosemont, IL! The exhibition will be co-located with The ASSEMBLY SHOW. With this partnership, we are bringing together all aspects of the engineering and electronics manufacturing industry!
Free to all attendees! Wednesday, October 23 - Thursday, October 24 Show Floor - UHDI Pavillion Booth #2753
Join us at the first-of-its-kind Ultra HDI Pavilion, where industry leaders will converge to explore the cutting-edge advancements in Ultra-High Density Interconnect (UHDI) technology. Explore a comprehensive schedule packed with technical sessions covering everything from The SMTA Ultra-HDI Test Board design to fabrication materials, assembly processes, and strategies to address continued miniaturization. A highlight you can't miss is the "Lab to Fab" working session, designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production. Whether you're looking to stay ahead of the curve or shape the future of miniaturization, the Ultra HDI Pavilion is where you need to be.
10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the big deal?" 11:00-11:30: John Johnson, ASC, "It depends PCB Design Trade Off's" 11:30-1:00: Networking
10:30am-11:00am >>Solder Performance and Reliability Assurance Project – Solder Performance and User Handbook for Defense Systems *Michael Osterman, CALCE
11:00am-11:30am >>Improving Reliability of High Performing PCB With Advanced Conformal Coating Use Rita Mohanty, Ph.D., Henkel Electronics Co-Authors: Alejandro Sanchez, Jeff Bowin, Paul Minagawa, Henkel Corporation
Thursday October 24, 2024 10:30am - 11:30am CDT
Room 47/49
Chair: Charles Woychik, Nhanced Semiconductors Co-Chair:
10:30am-11:00am >>Cu Conductive Paste as Via Filling Materials for Through Glass Via (TGV) Yoshinori Ejiri, Resonac Co., Ltd. Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Futoshi Oikawa, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.
11:00am-11:30am >>Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste Albert Wu, National Central University Co-Authors: Hung Wang, Ping-Hsuan Chen, National Central University; Watson Tseng, Chang-Meng Wang, Shenmao Technology Inc.
11:30am-12:00pm >>Non-toxic Stabilization for Mixed Reaction Gold Sandra Nelle, Atotech Deutschland GmbH & Co. KG Co-Authors: Britta Schafsteller, Robert Spreemann, Dirk Tews, Atotech Deutschland GmbH & Co.KG
Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 45
Chair: Prabjit Singh, Ph.D., IBM Corporation Co-Chair:
10:30am-11:00am >>Low Temperature Solder “Reverse Hybrid” Method to Simplify Tin-Bismuth Solder Conversions *Kevin Byrd, Intel Corporation Co-Authors: Dudi Amir, Alex Huettis, Yunfei Wang, Beihan Zhao, Intel Corporation
11:00am-11:30am >>Investigation of Compatibility and Mechanical Reliability in Low Temperature Soldering for Ball Grid Array Components Watson Tseng, Shenmao Technology Inc.
11:30am-12:00pm >>Unique Quality Control for The Success in Product Level Certification of Low Temperature Soldering with SnBi Based Alloy Kok Kwan Tang, TechLeap
Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 44/46
10:30am-11:00am >>Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach *Evan Griffith, Indium Corporation Co-Authors: David Heller, Xike Zhao, Phil Lehrer, Heller Industries
11:00am-11:30am >>Reduction of Condensate Residues in the Reflow Process by Targeted Control of Chemical Reactions *Viktoria Rawinski, Rawinski GmbH
11:30am-12:00pm >>How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance *Westin Bent, MacDermid Alpha Electronics Solutions Co-Authors: Jennifer Fijalkowski, Geoffrey Post, MacDermid Alpha Electronics Solutions; Shinichi Kitamiya, Ken Takahashi, Japan Unix
Thursday October 24, 2024 10:30am - 12:00pm CDT
Room 48
1:00pm-1:30pm >>Beyond the Technical Data Sheet Deborah Hagen, Ph.D., Sandia National Labs Co-Authors: Mark Dimke, Nalini Menon, and Erica McCready, Sandia National Labs
1:30pm-2:00pm >>2nd Generation of TIM Mina Yaghmazadeh, Ph.D., SJ Electronics Co-Authors: Youngjin Kim, Yunliang Dong, SJ Electronics
2:00pm-2:30pm >>Thermal Performance Comparison Between Liquid and Pad Thermal Interface Material Rita Mohanty, Ph.D., Henkel Corporation Co-Author: Blake Wageman, Henkel Corporation
Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 45
Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology Co-Chair:
1:00pm-1:30pm >>Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS *Francis Mutuku, Indium Corporation Co-Authors: Hongwen Zhang, Huaguang Wang, Tyler Richmond, Indium Corporation
1:30pm-2:00pm >>Wave Soldering the Lower Temperature Solder- A Case Study *Keith Sweatman, Nihon Superior Co., Ltd Co-Authors: Takatoshi Nishimura, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Co, Ltd; Kazuhiro Nogita, University of Queensland
2:00pm-2:30pm >>Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits *Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College Co-Authors: Wisdom Qu, Chris Nash, Indium Corporation
Thursday October 24, 2024 1:00pm - 2:30pm CDT
Room 44/46
