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Wednesday, October 23
 

11:00am CDT

MFX5: Cleaning, Rinsing, and High Temperature Solder Challenges
Wednesday October 23, 2024 11:00am - 12:30pm CDT
Chair: Scott Priore, Cisco Systems
Co-Chair: Richard Brooks, Spartronics

11:00am-11:30am
>>Electronic Assembly Rework Best Practices When Building to a No-Clean and Cleaning Conditions

*Mike Bixenman, MBA, DBA, Magnalytix, LLC
Co-Authors: J.D. Buller, AIR-VAC

11:30am-12:00pm
>>An Investigation in Rinse Water Sustainability
*Ram Wissel, KYZEN Corporation
Co-Author: Rod Chilton, ITW EAE

12:00pm-12:30pm
>>A Case Study on Assembly Process Optimization of 0201 BTC Diodes for High Temperature Reflow
Prathik Rudresh, Vicor Power
Co-Author: Chrys Shea, Shea Engineering Services

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 48

2:00pm CDT

MFX6: Cleaning Challenges and Solutions
Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Chair: Bev Christian, Ph.D., HDPUG
Co-Chair: Richard Brooks, Spartronics

2:00pm-2:30pm
>>Cleaning Under Bottom Terminated Components - Importance of Good Rinsing

*Vladimir Sitko, PBT Works s.r.o.
Co-Author: Mike Bixenmann, MBA, DBA, Magnalytix, LLC

2:30pm-3:00pm
>>Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

*Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; *Patrick Lawrence, ITW EAE; *Evan Griffith, Indium Corporation

3:00pm-3:30pm
>>Using Technical Cleanliness Assessments to Reduce Manufacturing Defect

Shelia Hamilton, Teknek

Wednesday October 23, 2024 2:00pm - 3:30pm CDT
Room 48
 
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