SMTA International 2024: Full Schedule

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11:00am CDT

APT1: Innovations in Wafer Level and Fan-Out Packaging

Wednesday October 23, 2024 11:00am - 12:30pm CDT

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Intel Corporation

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Ph.D., Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Wednesday October 23, 2024 11:00am - 12:30pm CDT
Room 45

Conference Session, APT Track

2:00pm CDT

APT2: Technological Advancements and System Solutions

Wednesday October 23, 2024 2:00pm - 3:00pm CDT

Room 45

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Making Cost-Effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

2:30pm-3:00pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Wednesday October 23, 2024 2:00pm - 3:00pm CDT
Room 45

Conference Session, APT Track