Chair: Francis Mutuku, Indium Corporation Co-Chair:
11:30am-12:00am >>Thermal Cycle Fatigue Life of Low Temperature Solders *Michael Osterman, CALCE/University of Maryland Co-Author: Aaron Mendelsohn, CALCE/University of Maryland
12:00pm-12:30pm >>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature *Raiyo Aspandiar, Ph.D., Intel Foundry Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project
Wednesday October 23, 2024 11:30am - 12:30pm CDT
Room 44
