SMTA International 2024

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Lavanya Ashok Swaminathan, Intel Corporation

11:00am-11:30am
>>The Renaissance of Electronics Packaging in the United States
*Charles Woychik, Ph.D., Nhanced Semiconductors
Co-Authors: Rouhan Noor, Himanandhan Reddy Kottur, Nitin Varshney, Navid Asadizanjani, University of Florida

11:30am-12:00pm
>>Panel Level Package (PLP) – Scaling up Fan-Out Packaging
*Burton Carpenter, NXP Semiconductors
Co-Authors: Mollie Flick, KH Mao, Cliff Kuo, Vanessa Tan, NXP Semiconductors

12:00pm-12:30pm
>>Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
*Lars Boettcher, Fraunhofer IZM Berlin

Chair: Scott Priore, Cisco Systems
Co-Chair: Richard Brooks, Spartronics

11:00am-11:30am
>>Electronic Assembly Rework Best Practices When Building to a No-Clean and Cleaning Conditions
*Mike Bixenman, MBA, DBA, Magnalytix, LLC
Co-Authors: J.D. Buller, AIR-VAC

11:30am-12:00pm
>>An Investigation in Rinse Water Sustainability
*Ram Wissel, KYZEN Corporation
Co-Author: Rod Chilton, ITW EAE

12:00pm-12:30pm
>>A Case Study on Assembly Process Optimization of 0201 BTC Diodes for High Temperature Reflow
Prathik Rudresh, Vicor Power
Co-Author: Chrys Shea, Shea Engineering Services

Chair: Francis Mutuku, Indium Corporation
Co-Chair:

11:30am-12:00am
>>Thermal Cycle Fatigue Life of Low Temperature Solders
*Michael Osterman, CALCE/University of Maryland
Co-Author: Aaron Mendelsohn, CALCE/University of Maryland

12:00pm-12:30pm
>>Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature
*Raiyo Aspandiar, Ph.D., Intel Foundry
Co-Authors: Richard Coyle, Ph.D., Nokia Bell Labs; Dan Burkholder, Intel Corporation, and other members of the iNEMI LTS PR Project

Chair: Laura Cohen, Woodward
Co-Chair:

11:30am-12:00pm
>>A New Efficient and Easy-to-Use Thermomechanical Reliability Model for Lead-Free Solder Joints
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics

12:00pm-12:30pm
>>Use of AI to Predict the Compatibility Between Solder Paste Residues and Coatings
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Christophe Dehon, Inventec Performance Chemicals

Chair: Lars Boettcher, Fraunhofer IZM Berlin
Co-Chair: Dale Lee, Plexus Corp.

2:00pm-2:30pm
>>Making Cost-Effective Design Decisions For Microelectronics Packaging
Amy Lujan, SavanSys Solutions

2:30pm-3:00pm
>>Component Obsolescence or Unavailability... Solved
Greg Papandrew, DirectPCB
Co-Authors: Jeff Dyson, Winslow Adaptics

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair: Richard Brooks, Spartronics

2:00pm-2:30pm
>>Cleaning Under Bottom Terminated Components - Importance of Good Rinsing
*Vladimir Sitko, PBT Works s.r.o.
Co-Author: Mike Bixenmann, MBA, DBA, Magnalytix, LLC

2:30pm-3:00pm
>>Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
*Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; *Patrick Lawrence, ITW EAE; *Evan Griffith, Indium Corporation

3:00pm-3:30pm
>>Using Technical Cleanliness Assessments to Reduce Manufacturing Defect
Shelia Hamilton, Teknek

Chair: Keith Bryant, KB Consultancy
Co-Chair: Albert Wu, National Central University Taiwan

2:00pm-2:30pm
>>Comparative Study for Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
Lavanya Ashok Swaminathan, Intel Corporation
Co-Authors: Agustin Vasquez, Ph.D., Pubudu Goonetilleke, Raiyo Aspandiar, Ph.D., Qinglei Zhang, Intel Foundry

2:30pm-3:00pm
>>The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
Saddam Daradkeh, Ph.D., Auburn University
Co-Authors: Elizabeth Gainey, Mohamed El Amine Belhadi, Abdallah Alakayleh, Menghong Wang, Sa’d Hamasha, Ph.D., Auburn University

3:00pm-3:30pm
>>Exploring Thermocouple Attachment Techniques for PCB Thermal Profiling
Miles Moreau, KIC
Co-Authors: Chrys Shea, Shea Engineering; Martin Anselm, Ph.D., Rochester Institute of Technology