Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.
8:30am-9:00am >>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys *Richard Coyle, Ph.D., Nokia Bell Labs Co-Authors: See paper for full listing
9:00am-9:30am >>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature Mathias Nowottnick, University of Rostock Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock
9:30am-10:00am >> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies *Anna Lifton, MacDermid Alpha Electronics Solutions Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, MacDermid Alpha Electronics Solutions
Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 49
Chair: Maurice Dore, Valeo Co-Chair: Lavanya Ashok Swaminathan, Intel Corporation
10:30am-11:00am >>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination Victoria Delissio, Heraeus Electronics
1:00pm-1:30pm >>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments *Mike Konrad, Aqueous Technologies
1:30pm-2:00pm >>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board Donghyun Kim, Ph.D., Nokia Bell Labs Co-Author: Chen Xu, Nokia Bell Labs
2:00pm-2:30pm >>A New Approach to Process Qualification – SIR Testing + Functional Components *Mike Bixenman, MBA, DBA, Magnalytix LLC Co-Authors: Terry Munson, Foresite
Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 49
Chair: David Hillman, Hillman Electronic Assembly Solutions Co-Chair: Chloe Feng, Nokia Bell Labs
3:00pm-3:30pm >>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints *Jayse McLean, John Deere Intelligent Solutions Group
3:30pm-4:00pm >>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points *Anthony Rafanelli, Ph.D., P.E., Rafanelli Engineering
4:00pm-4:30pm >>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability *Richard Coyle, Ph.D., Nokia Bell Labs Co-Authors: See paper for full listing
Tuesday October 22, 2024 3:00pm - 4:30pm CDT
Room 49
Free and Open to All Attendees Sponsored by iNEMi/HDP/SMTA
iNEMI/HDP/SMTAI will host a "town hall meeting" open to all conference attendees for a wide-open interactive discussion on the topic of thermal cycle vs. thermal shock testing of solder joints. All discussion positions and opinions will be welcomed in an interactive expansive topic forum where the session attendees' questions and comments will lead the discussion. You are invited to submit questions and topics in advance to: crgdragon@gmail.com
*Snacks and refreshments will be provided
Tuesday October 22, 2024 5:00pm - 6:00pm CDT
Room 49
