Chair: Maria Tanasescu, AMD Co-Chair: Michelle Brown, Continental
8:30am-9:00am >>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies Kunal Shah, Ph.D., Lilotree
9:00am-9:30am >>DRAM Damage Due to X-Ray Inspections Post PCB Assembly Saurabh Gupta, Ph.D., Intel Corporation
9:30am-10:00am >>Case Studies of Harsh Application Environments, the Unforeseen Situations *Christopher Genthe, *Kelly Flanagan, Rockwell Automation
Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48
10:30am-11:00am >>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 Years Beyond *Paul Wang, Ph.D., MiTAC Computer Technology Co-Author: Dennis Willie, Flex
11:00am-11:30am >>Large Form Factor Surface Mount Technology Process Demonstration Saurabh Gupta, Ph.D., Intel Corporation Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation
11:30am-12:00pm >>Examination of Cutting Edge Quality and the Influences of Laser Depaneling Jake Benz, LPKF Laser & Electronics North America Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE
Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 48
1:00pm-1:30pm >>Sustainable and Strategic Design to Combat Component Unavailability *Kathryn Ackerman, Sourceability
1:30pm-2:00pm >>Design for Manufacturability - Perspectives from a Manufacturing Engineer David Spitz, Ansys, Inc.
2:00pm-2:30pm >>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University
Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 48
3:00pm-3:30pm >>How AI Can Accelerate R&D for Solder Paste Formulations Melanie Mathon, Inventec Performance Chemicals Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals
3:30pm-4:00pm >>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE) *Joerg Trodler, Dipl.-Ing., Trodler-EAVT Co-Author: Thomas Ruch, Stannol
Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48
