SMTA International 2024: Full Schedule

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8:30am CDT

INS1: New Developments in AI, Machine Learning, and Machine Vision Applications in Test & Inspection

Tuesday October 22, 2024 8:30am - 10:00am CDT

Chair:
Co-Chair:

8:30am-9:00am
>>Machine Vision-Based Plated Through Hole Defect Inspection Model for Large-Scale PCB Manufacturing Industries
Jinal Prajapati, Watson Institute for System Excellence, Binghamton University
Co-Authors: Soujanya Nagaraja Rao Malur, Prashanth Tamilselvam, Darshil Patel, Daryl Santos, Watson Institute for System Excellence, Binghamton University

9:00am-9:30am
>>Artificial Intelligence and its Role in Improving Automated Optical Inspection
Edward Pechin, Vitrox USA

9:30am-10:00am
>>Machine Learning-Based Server Testing and Debugging Model for Large-Scale PCB Manufacturing Industries
Soujanya Nagaraja Rao Malur, Binghamton University
Co-Authors: Aditya Shobhawat, Foxconn Industrial Internet; Darshil Rajeshkumar Patel, Daryl Santos, Ph.D., Watson Institute for Systems Excellence, Binghamton University

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 44

Conference Session, INS Track

8:30am CDT

MFX1: Reliability Challenges

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 48

Chair: Maria Tanasescu, AMD
Co-Chair:

8:30am-9:00am
>>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies
Kunal Shah, Ph.D., Lilotree

9:00am-9:30am
>>DRAM Damage Due to X-Ray Inspections Post PCB Assembly
Surabh Gupta, Ph.D., Intel Corporation

9:30am-10:00am
>>Case Studies of Harsh Application Environments, the Unforeseen Situations
*Christopher Genthe, *Kelly Flanagan, Rockwell Automation

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 48

Conference Session, MFX Track

8:30am CDT

RHE1: Solder Joint Reliability

Tuesday October 22, 2024 8:30am - 10:00am CDT

Room 47/49

Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.

8:30am-9:00am
>>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

9:00am-9:30am
>>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature
Mathias Nowottnick, University of Rostock
Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock

9:30am-10:00am
>> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies
*Anna Lifton, Macdermid Alpha Electronics Solutions
Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions

Tuesday October 22, 2024 8:30am - 10:00am CDT
Room 47/49

Conference Session, RHE Track

10:30am CDT

INS2: Unique Materials and Lab-Based Inspection & Test Applications

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 44

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

10:30am-11:00am
>>Using True 3D to Optimize Your Dispensing Process: A Journey Toward Zero Defects
Daniel Perry, Koh Young Technology, Inc.

11:00am-11:30am
>>Calibration of Tweezer Meters Enabling Sub-1pF and Sub-1nH Measurements
Michael Obrecht, Ph.D., Siborg Systems Inc

11:30am-12:00pm
>>A Survey of the Sources of Ionic Contamination as Measured by Ion Chromatography during Electronics Manufacturing
*Adam Klett, Ph.D., KYZEN Corporation
Co-Authors: Ram Wissel, James Perigen, KYZEN Corporation

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 44

Conference Session, INS Track

10:30am CDT

MFX2: Large Panel Assembly

Tuesday October 22, 2024 10:30am - 12:00pm CDT

Room 48

Chair:
Co-Chair:

10:30am-11:00am
>>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond
*Paul Wang, Ph.D., MiTAC Computer Technology
Co-Author: Dennis Willie, Flex

11:00am-11:30am
>>Large Form Factor Surface Mount Technology Process Demonstration
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation

11:30am-12:00pm
>>Examination of Cutting Edge Quality and the Influences of Laser Depaneling
Jake Benz, LPKF Laser & Electronics North America
Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE

Tuesday October 22, 2024 10:30am - 12:00pm CDT
Room 48

Conference Session, MFX Track

11:00am CDT

RHE2: Reliability Aspects of High Performance Components

Tuesday October 22, 2024 11:00am - 12:00pm CDT

Room 47/49

Chair:
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination
Victoria Delissio, Heraeus Electronics

11:30am-12:00pm
>>Board Level Reliability Testing of RF Packages
Mumtaz Bora, Psemi

Tuesday October 22, 2024 11:00am - 12:00pm CDT
Room 47/49

Conference Session, RHE Track

1:00pm CDT

INS3: Evolution and Trends in Current Xray Inspection Applications & Technology

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

1:00pm-1:30pm
>>Review of the Latest Developments of the Xray Inspection Technology for PCBAs and Microelectronics Designs
Evstatin Krastev, Ph.D., Nordson

1:30pm-2:00pm
>>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection
Nick Fieldhouse, M.S., Omron Inspection Systems

2:00pm-2:30pm
>>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control
Eric McElmurry, Viscom USA

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 44

Conference Session, INS Track

1:00pm CDT

MFX3: Design and Sustainability

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 48

Chair: Jon Ashton, CSMTPE, Universal Instruments
Co-Chair: Mei-Ming Khaw, Keysight Technologies

1:00pm-1:30pm
>>Sustainable and Strategic Design to Combat Component Unavailability
*Kathryn Ackerman, Sourceability

1:30pm-2:00pm
>>Design for Manufacturability - Perspectives from a Manufacturing Engineer
David Spitz, Ansys, Inc.

2:00pm-2:30pm
>>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process
Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University
Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 48

Conference Session, MFX Track

1:00pm CDT

RHE3: Reliability and Cleanliness

Tuesday October 22, 2024 1:00pm - 2:30pm CDT

Room 47/49

Chair:
Co-Chair: Doug Pauls, Collins Aerospace

1:00pm-1:30pm
>>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments
*Mike Konrad, Aqueous Technologies

1:30pm-2:00pm
>>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board
Donghyun Kim, Ph.D., Nokia Bell Labs
Co-Author: Chen Xu, Nokia Bell Labs

2:00pm-2:30pm
>>A New Approach to Process Qualification – SIR Testing + Functional Components
*Mike Bixenman, MBA, DBA, Magnalytix LLC
Co-Authors: Terry Munson, Foresite

Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 47/49

Conference Session, RHE Track

3:00pm CDT

INS4: Challenging AOI Applications

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 44

Chair: Maria Tanasescu, AMD
Co-Chair:

3:30pm-4:00pm
>>Pre- and Post-Solder AOI for THT
John Johnson, EAP

4:00pm-4:30pm
>>Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys
Gayle Towell, AIM Solder
Co-Authors: Timothy O’Neill, Carlos Tafoya, Andres Lozoya, AIM Solder; Nick Fieldhouse, Omron Inspection Systems

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 44

Conference Session, INS Track

3:00pm CDT

MFX4: Solder Pastes and Interconnection Materials

Tuesday October 22, 2024 3:00pm - 4:00pm CDT

Room 48

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Tuesday October 22, 2024 3:00pm - 4:00pm CDT
Room 48

Conference Session, MFX Track

3:00pm CDT

RHE4: Thermal Shock & Thermal Cycle Testing Comparisons

Tuesday October 22, 2024 3:00pm - 4:30pm CDT

Room 47/49

Chair: David Hillman, Hillman Electronic Assembly Solutions
Co-Chair: Chloe Feng, Nokia Bell Labs

3:30pm-4:00pm
>>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints
*Jayse McLean, John Deere Intelligent Solutions Group

4:00pm-4:30pm
>>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points
*Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering

4:30pm-5:00pm
>>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

Tuesday October 22, 2024 3:00pm - 4:30pm CDT
Room 47/49

Conference Session, RHE Track