SMTA International 2024

Chair:
Co-Chair:

8:30am-9:00am
>>Machine Vision-Based Plated Through Hole Defect Inspection Model for Large-Scale PCB Manufacturing Industries
Jinal Prajapati, Watson Institute for System Excellence, Binghamton University
Co-Authors: Soujanya Nagaraja Rao Malur, Prashanth Tamilselvam, Darshil Patel, Daryl Santos, Watson Institute for System Excellence, Binghamton University

9:00am-9:30am
>>Artificial Intelligence and its Role in Improving Automated Optical Inspection
Edward Pechin, Vitrox USA


9:30am-10:00am
>>Machine Learning-Based Server Testing and Debugging Model for Large-Scale PCB Manufacturing Industries
Soujanya Nagaraja Rao Malur, Binghamton University
Co-Authors: Aditya Shobhawat, Foxconn Industrial Internet; Darshil Rajeshkumar Patel, Daryl Santos, Ph.D., Watson Institute for Systems Excellence, Binghamton University

Chair: Maria Tanasescu, AMD
Co-Chair:

8:30am-9:00am
>>Sustainability is a Key Parameter for Material and Chemistry Choices for Next Generation Electronic Assemblies
Kunal Shah, Ph.D., Lilotree

9:00am-9:30am
>>DRAM Damage Due to X-Ray Inspections Post PCB Assembly
Surabh Gupta, Ph.D., Intel Corporation

9:30am-10:00am
>>Case Studies of Harsh Application Environments, the Unforeseen Situations
*Christopher Genthe, *Kelly Flanagan, Rockwell Automation

Chair: Ron Lasky, Ph.D., P.E., Indium Corporation, Dartmouth College
Co-Chair: Brian Roggeman, Qualcomm Technologies Inc.

8:30am-9:00am
>>The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing

9:00am-9:30am
>>Investigation of the Mechanical Strength of Solder Joints at Elevated Temperature
Mathias Nowottnick, University of Rostock
Co-Author: Andrej Novikov, Phillip Gabel, University of Rostock

9:30am-10:00am
>> Evaluating Reliability Enhancement of Polymer Reinforcement and Solder Alloy Combined Material Sets on Board Level Assemblies
*Anna Lifton, Macdermid Alpha Electronics Solutions
Co-Authors: Paul Salerno, Cole Sandvold, Pritha Choudhury, Raghu Raj Rangaraju, Eric Bradley, Macdermid Alpha Electronics Solutions

PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Instructor: Michael Vinson, Electroninks

This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication.
Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.

Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE.

Schedule
Tuesday, October 22 - Course (8:30am-5:00pm)
Wednesday, October 23 - ½ day of course + exam (8:30am-5:00pm)
Thursday, October 24 - All day exam (8:30am-5:00pm)

Registration Fees (pricing in USD)
Member: $1300
Non-Member: $1500
*Includes test and study guide with workshop
Register Here: https://smta.org/events/EventDetails.aspx?id=1796342&group=

Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting

Questions?
SMTA Certification
certification@smta.org

Chair: Bev Christian, Ph.D., HDPUG
Co-Chair:

10:30am-11:00am
>>Using True 3D to Optimize Your Dispensing Process: A Journey Toward Zero Defects
Daniel Perry, Koh Young Technology, Inc.

11:00am-11:30am
>>Calibration of Tweezer Meters Enabling Sub-1pF and Sub-1nH Measurements
Michael Obrecht, Ph.D., Siborg Systems Inc

11:30am-12:00pm
>>A Survey of the Sources of Ionic Contamination as Measured by Ion Chromatography during Electronics Manufacturing
*Adam Klett, Ph.D., KYZEN Corporation
Co-Authors: Ram Wissel, James Perigen, KYZEN Corporation

Chair:
Co-Chair:

10:30am-11:00am
>>iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond
*Paul Wang, Ph.D., MiTAC Computer Technology
Co-Author: Dennis Willie, Flex

11:00am-11:30am
>>Large Form Factor Surface Mount Technology Process Demonstration
*Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Authors: Alexander Huettis, Patrick Nardi, Abid Ameen, Jiaqi Wu, Intel Corporation

11:30am-12:00pm
>>Examination of Cutting Edge Quality and the Influences of Laser Depaneling
Jake Benz, LPKF Laser & Electronics North America
Co-Author: Patrick Stockbruegger, LPKF Laser & Electronics SE

Chair:
Co-Chair: Lavanya Ashok Swaminathan, Rochester Institute of Technology

11:00am-11:30am
>>Next-Level Reliability: Enhancing Automotive Electronics with a Pb-Free Thick Film and Solder Combination
Victoria Delissio, Heraeus Electronics

11:30am-12:00pm
>>Board Level Reliability Testing of RF Packages
Mumtaz Bora, Psemi

Chair: Maria Tanasescu, AMD
Co-Chair:

1:00pm-1:30pm
>>Review of the Latest Developments of the Xray Inspection Technology for PCBAs and Microelectronics Designs
Evstatin Krastev, Ph.D., Nordson

1:30pm-2:00pm
>>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection
Nick Fieldhouse, M.S., Omron Inspection Systems

2:00pm-2:30pm
>>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control
Eric McElmurry, Viscom USA

Chair: Jon Ashton, CSMTPE, Universal Instruments
Co-Chair: Mei-Ming Khaw, Keysight Technologies

1:00pm-1:30pm
>>Sustainable and Strategic Design to Combat Component Unavailability
*Kathryn Ackerman, Sourceability

1:30pm-2:00pm
>>Design for Manufacturability - Perspectives from a Manufacturing Engineer
David Spitz, Ansys, Inc.

2:00pm-2:30pm
>>Predicting Delivery Reliability of Logistics Forwarders: A Machine Learning Approach for Forwarder Selection and Evaluation Process
Sai Srikanth Reddy Kolli, Watson Institute for System Excellence, Binghamton University
Co-Authors: Sung Hoon Chung, Binghamton University; Edward Wong, Foxconn Industrial Internet; Daryl Santos, Binghamton University

Chair:
Co-Chair: Doug Pauls, Collins Aerospace

1:00pm-1:30pm
>>The Relationship Between Cleanliness and Reliability of Circuit Assemblies Employed in Harsh Environments
*Mike Konrad, Aqueous Technologies

1:30pm-2:00pm
>>Influence of Salt Contamination and RH on Creep Corrosion of Immersion Sliver (ImAg) Board
Donghyun Kim, Ph.D., Nokia Bell Labs
Co-Author: Chen Xu, Nokia Bell Labs

2:00pm-2:30pm
>>A New Approach to Process Qualification – SIR Testing + Functional Components
*Mike Bixenman, MBA, DBA, Magnalytix LLC
Co-Authors: Terry Munson, Foresite

Chair: Maria Tanasescu, AMD
Co-Chair:

3:30pm-4:00pm
>>Pre- and Post-Solder AOI for THT
John Johnson, EAP

4:00pm-4:30pm
>>Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys 
Gayle Towell, AIM Solder
Co-Authors: Timothy O’Neill, Carlos Tafoya, Andres Lozoya, AIM Solder; Nick Fieldhouse, Omron Inspection Systems

Chair:
Co-Chair:

3:30pm-4:00pm
>>How AI Can Accelerate R&D for Solder Paste Formulations
Melanie Mathon, Inventec Performance Chemicals
Co-Authors: Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon, Inventec Performance Chemicals

4:00pm-4:30pm
>>Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC, and LE)
*Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Co-Author: Thomas Ruch, Stannol

Chair: David Hillman, Hillman Electronic Assembly Solutions
Co-Chair: Chloe Feng, Nokia Bell Labs

3:30pm-4:00pm
>>Thermal Shock Testing of High-Reliability Mixed BGA Solder Joints
*Jayse McLean, John Deere Intelligent Solutions Group

4:00pm-4:30pm
>>Thermal Shock versus Thermal Cycle with Respect to Electronics Performance – Some Discussion Points
*Anothny Rafanelli, Ph.D., P.E., Rafanelli Engineering

4:30pm-5:00pm
>>A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
*Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See paper for full listing