SMTA International 2024

PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Instructor: Phil Zarrow, Jim Hall, ITM Consulting

You have the responsibility and resources to improve the productivity of an assembly operation....what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line
engineers involved in manufacturing, design and quality engineering.

PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC

Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found  in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.

PDC7: Analytical Techniques in Electronics Manufacturing: Theory, Applications, and Data Interpretation"
Instructor: Adam Klett, Ph.D., KYZEN Corporation

Whether you're an executive, a seasoned researcher, or a newcomer, this course is designed to sharpen
your analytical prowess and equip you with the knowledge and skills necessary for advancing electronics
manufacturing. This course offers an in-depth exploration of analytical techniques ubiquitous in electronics
manufacturing, including:
• Fourier Transform Infrared Spectroscopy (FTIR)
• Ion Chromatography (IC)
• Scanning Electron Microscopy with Energy-Dispersive X-ray Spectroscopy (SEM/EDS)
• Resistivity of Solvent Extract (ROSE)

Participants will gain a comprehensive understanding of the theoretical foundations, practical applications, and nuanced interpretation of raw data associated with each method. The journey begins with thoroughly examining the underlying principles governing these techniques, providing a solid theoretical framework. Subsequently, the course delves into the capabilities and limitations of each method, shedding light on their unique strengths and potential pitfalls. Central to the course is the exploration of strategies for interpreting raw data. Through real-world case studies and interactive discussions, participants will learn to extract meaningful insights from complex datasets, enhancing their analytical skills and decision-making capabilities.

PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Instructors: Chrys Shea, Shea Engineering Services and Raymond Lawrence, CeTaQ

This advanced course is designed for process engineers and technical leaders who want to learn how to improve the productivity of their SMT lines. Emphasis is on the relationships among different process variables, how to characterize them, and how to maximize yields and throughputs. The course begins with an overview of quality attributes and how to apply workmanship standards to achieve acceptable conditions while minimizing rework. It then details each SMT process on a typical assembly line, including automated inspection, and discusses how each can factor into process indicators or unacceptable outputs. After reviewing the processing factors that influence defects, process control methods are introduced. Discussions then focus on designed experiments to identify the main drivers of quality output, and line balancing for optimizing throughput. The technical discussions turn to business discussions - of financial considerations, the cost of defects, capital equipment justifications and data-driven evaluation methods for assembly machines and materials. Equipment evaluation, characterization, and process control are emphasized in the final portion of the course, encouraging attendees to integrate the concepts of quality, repeatability, and profitability as they apply to SMT manufacturing.

PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Instructor: Jennie Hwang, Ph.D., H-Technologies Group

As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course also highlights what it takes to achieve AI with justified confidence.

Integrated with a variety of use cases, tips, and recommendations, the key components behind the AI technologies including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, and ChatGPT-led AI boom will be outlined, and “possible” AI future will be highlighted. All industry sectors are expected to reorient around AI; the ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!

Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, Formerly with IBM Corporation

9:00am-9:30am
>>Metal Organic Decomposition (MOD) Inks and Films for Electromagnetic Interference (EMI) Shielding and Semi Additive Process (SAP)
Mike Vinson, Electroninks
Co-Authors: Sima Hannani, Melbs LeMieux, Brett Walker, Electroninks

9:30am-10:00am
>>3D Aerosol Jet Printed Interconnects on Bare Die
*Tom Rovere, Lockheed Martin
Co-Authors: Kurt Christiansen, John Wright, Chris Torbitt, Lockheed Martin

Chair: Andy Behr, Panasonic
Co-Chair:

10:30am-11:00am
>>Sensors and Process-Performance Interactions for Additive In-Mold Electronics in Automotive Applications
*Pradeep Lall, Ph.D., Auburn University
Co-Authors: Hyesoo Jang, Ved Soni, Fatahi Musa, Md Golam Sarwar, Scott Miller, Auburn University

11:00am-11:30am
>>Current Minimum Micro Bump Size Using Gravure Offset Equipment
Douglas Schardt, Komori America Corp
Co-Authors: Shunichi Haraguchi, Chisato Oyama, Kotarou Usuda, Yoshihiro Ohyama, Ikeda Hideki, Komori Corporation

11:30am-12:00pm
>>Additive Manufactured Electronics for Next Generation Microelectronics
Kenneth Church, nScrypt, Inc.

Additively Manufactured Electronics: A View from The Ecosystem
Speaker: Arthur Wall, Ph.D., Director of Engineering and Fab Operations, NextFlex

Additive technology is changing our world. Simple 3D printed structures have evolved to become critical components in the manufacture of devices that we could not have imagined just a few years ago. Now comes the emergence of, the implementation of, and the continued evolution of, additive electronics. There are so many exciting examples of materials, tools, processes, and systems that are now emerging in the ecosystem indicating that this new technology cannot be ignored. More importantly, it is being adopted into manufacturing today. In this discussion, we will explore several well-known manufacturing approaches that push the boundaries of today’s capability and new entrants with innovative methods and materials. We will also describe the importance of additive electronics manufacturing for its impact ono environmental sustainability. Finally, future developments of systems and applications will be presented as part of an overall electronics national strategy.

Meet Art Wall
Art Wall is Director of Engineering and Fab Operations at NextFlex, managing the Technology Hub which houses multiple process tools for Additive and Flexible Hybrid Electronics development and prototyping. Prior to joining NextFlex, Art led many different groups and technologies associated with hard drive products for both IBM and Hitachi Global Storage Technologies. His most recent efforts prior to joining NextFlex were as a co-founder and Vice President of NuvoSun, an innovative photovoltaic company that was acquired by The Dow Chemical Company. Art has a Ph.D. in Materials Science from the University of Minnesota. Art has co-authored more than 30 articles in refereed journals, presented at more than 30 US and International Conferences, and holds 7 US patents.

Chair: MP Divakar, Stack Design Automation
Co-Chair:

1:30pm-2:00pm
>>SMT Processing using Printed Anisotropic Conductive Epoxy for Direct Die Attach of Wire-bondable Chips on Flexible Additively Manufactured Electronics
Madhu Stemmerman, Sunray Scientific

2:00pm-2:30pm
>>Interconnecting and Soldering to Printed Ink Metallization Using Photonic Processes
Harry Chou, Ph.D., PulseForge
Co-Authors: Ogadimma John Okwuoma, Dave Pope, Ph.D., Ian Rawson, Ara Parsekian, Ph.D., PulseForge

2:30pm-3:00pm
>>In-Mold Electronics: An Additive Manufacturing Approach for Integrated, Robust and 3D Electronics
Rahul Raut, MacDermid Alpha Electronics Solutions
Co-Authors: Bawa Singh, NirmalyaKumar Chaki, Chetan Shah, Vasuki Kaushik, Supriya Devarajan, MacDermid Alpha Electronics Solutions

FREE FOR ALL ATTENDEES!
Chairs: Marie Cole, Formerly with IBM Corporation; Priyanka Dobriyal, Intel Corporation

>>AI Era - Work, Life, Technology, Leadership, and Women"
Jennie Hwang, Ph.D., H-Technologies Group

>>Coming soon!
Mandy Long, BigBear AI

>>Women Shaping SMTA: Past Contributions and Future Visions
The panel aims to highlight the contributions of remarkable women who have made significant impacts to the industry, championed diversity, and played pivotal roles in advancing SMTA while on the Board of Directors.
​​​Panelists (Time Served on SMTA Board of Directors)
Moderator: Michelle Ogihara, Seika Machinery (2011-2016)
Debbie Carboni, KYZEN Corporation (2014-2020)
Marie Cole, IBM Corporation (2008-2013)
Priyanka Dobriyal, Ph.D. , Intel Corporation (2023-Current)
Eileen Hibbler, SMTA (2016-2018)
Tanya Martin, SMTA (Global Excutive Director)
Julie Silk, Keysight Technologies (2019-Current)
Frances Stewart, PCEA (1996-1998)

Chair: MP Divakar, Stack Design Automation
Co-Chair:

3:30pm-4:00pm
>>Breaking Barriers: Advancing Electronics Tooling and Pallet Manufacturing with Additive Manufacturing
Jeff DeGrange, Impossible Objects
Co-Author: Dan Migely, Impossible Objects

4:00pm-4:30pm
>>Supercooled Solder Pastes in Low Temperature Attach Applications
Yifan Wu, Ph.D., Indium Corporation
Co-Authors: Ian Tevis, Radhika Jadhav, Indium Corporation

4:30pm-5:00pm
>>AI-Powered Real-Time Inspection for Electronic Component Assembly
Sean Bouskila, Cybord
Co-Author: Eyal Weiss, Cybord

FREE FOR ALL ATTENDEES
Join experts and fellow attendees to explore the evolution and innovation of the different electronics manufacturing sectors. Topics include:

>>Past, Present, and Future of Soldering
Hosted by: Gayle Towell, AIM Solder

>>Past, Present, and Future of Cleaning/High Reliability

>>Past, Present, and Future of Marketing/Sales
Hosted by: Stephanie Austin, Zentech Manufacturing

>>Past, Present and Future of Research & Development

>>Past, Present and Future of Green Energy/Sustainability

FREE FOR ALL ATTENDEES

Join the Women's Leadership Program as we mingle with drinks and nibbles with fellow attendees!
More details coming soon….