SMTA International 2024

PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies
Instructor: Amy Lujan,SavanSys Solutions LLC

This PDC will present process flows and analyze the cost drivers of mature and advanced packaging technologies. Activity-based cost modeling will be used, and this course will explain why and how cost modeling is useful. The technologies covered are wire bond, flip chip, wafer-level packaging (fan-in and fan-out), and interposer-based packaging (also called 2.5D). Each packaging technology will be introduced, process flow(s) will be presented in step-by- step detail, and cost drivers will be highlighted. Cost drivers are design parameters that have a notable impact on the final package cost. All types of direct cost will be covered, including labor, material, capital, tooling, and yield; indirect costs will be explained as well. Case studies will be provided for each packaging technology. The goal of this PDC is to teach which design details drive different types of cost to both technical and non-technical people in the microelectronics supply chain. With a better understanding of packaging technology cost drivers, cost-effective decisions can be made.

PDC2: LTS 101: Manufacturing Process Guidance for Implementation of SnBi Based Low Temperature Soldering for Consumer Products
Instructor: Kok Kwan Tang, TechLeap PLT

Interest in Low Temperature Soldering (LTS) as a soldering technology solution for consumer products has been on the rise. The primary challenge limiting the adoption of LTS is the lack of knowledge to define and optimize the manufacturing process, identify solutions to overcome manufacturing defects, define and execute LTS product certification. This course is constructed with learnings from actual LTS product implementation in High Volume Manufacturing, collectively >20 consumer products since 2016. This course will also walk through key factors to successfully implement and certify consumer products with the LTS process.

PDC4: Failure Analysis of Electronic Devices
Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis

The supply chain of electronic devices is large and complex. It comprises designers, component suppliers, board manufacturers and assembly providers. When something goes wrong, the failure mechanism is not always obvious. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear. In this workshop, we will review the tools of failure analysis, explaining each technique and what information it provides. Concrete examples will be used.

PDC5: Fundamentals of Thermal Interface Materials
Instructor: Rita Mohanty, Ph.D., Henkel Corporation

The cooling of electronics is critical to the safety, performance, and reliability of contemporary electronic systems. Electronics industries continue to move towards highly integrated devices with smaller feature sizes and higher currents with smaller footprint devices. Higher functionality comes with the price of high heat generation due to higher power dissipation. In general, heat from a system can be removed by conduction, convection and radiation. For most electronic applications, heat is primarily removed by transferring heat by conduction and natural convection through a solid medium. Polymer base Thermal Interface Material (TIM) is one of the most effecting media used in thermal management today.
TIM offer many benefits beyond exceptional thermal management such as electrical isolation for high power electronics, vibration dampening leading to improved reliability, tolerance stack up issue for mechanical parts leading to cost savings in product design, low outgassing to meet NASA outgassing criteria, just to name a few. Thermal interface material comes in different forms such as film, liquid and paste to fill gap from micron scale to millimeter scale. In this course, we will discuss some common types of TIM used in TIM 2 and TIM 1.5 applications. Value associated with each type of TIM and their common applications will be discussed here.