Chair: Maria Tanasescu, AMD Co-Chair: Keith Bryant, KB Consultancy
1:00pm-1:30pm >>Review of the Latest Developments of the X-Ray Inspection Technology for PCBAs and Microelectronics Designs Evstatin Krastev, Ph.D., Nordson
1:30pm-2:00pm >>A Close Look at BGA Measurements, IPC Guidelines, and Xray Inspection Nick Fieldhouse, M.S., Omron Inspection Systems
2:00pm-2:30pm >>X-Ray Inspection of Voids in SMT Production: Testing Strategies with 3D-AXI for Optimal Process Control Eric McElmurry, Viscom USA
Tuesday October 22, 2024 1:00pm - 2:30pm CDT
Room 44